Flexible Heat Dissipation Sheet for Electronic Device Thermal Management
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Solution Overview
Problem
Existing electronic devices face challenges in effectively dissipating heat generated by integrated circuit chips, with conventional solutions like metal radiators and shell-based heat diffusion being inadequate.
Innovation Solution
A flexible heat dissipation member with multiple portions connected by folds is used, where one portion is fixed on the chip and the other portions are locally adhered or welded, providing a large heat exchange surface with both the encapsulation block and the outside, while maintaining a reduced device thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal plate with fins is glued onto the chip to form a heat sink, then heat dissipation capability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent uses a flexible heat dissipation film instead of a rigid metal plate with fins. This flexible film can be easily attached to the chip surface and conforms to the chip's geometry, providing effective heat dissipation without requiring complex fin structures or adhesive bonding processes.
Solution Approach 2:
The patent extracts the heat dissipation function from a complex metal heat sink structure and implements it through a simple flexible film that can be integrated directly into the device assembly, reducing overall device complexity while maintaining thermal management effectiveness.
2Temperature
If the chip is placed against the device casing for heat dissipation, then heat dissipation is improved, but the device thickness increases
Solution Approach 1:
The flexible heat dissipation film is a thin component that can be attached to the chip without significantly increasing device thickness. Its flexibility allows it to conform to the chip surface and provide effective thermal contact without requiring the chip to be placed against the device casing, thus maintaining a compact form factor.
3Area of stationary object
If a flexible sheet with multiple folded portions is used, then heat exchange surface area is increased, but manufacturing complexity increases
Solution Approach 1:
The flexible heat dissipation film is divided into multiple portions connected by folds, allowing each portion to be independently positioned and attached to different surfaces. This segmentation increases the total heat exchange surface area while maintaining manufacturing simplicity through a single continuous film structure that can be easily formed and assembled.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible sheet effectively dissipates heat through a large surface area, maintaining its shape and ensuring proper positioning, thereby enhancing thermal management without increasing the device's size.
Implementation Method 1
The end of a second portion is fixed at least locally to the first portion by means of a thermal adhesive or thermal paste
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
Electronic device comprising a support (2), a component, in particular an integrated circuit chip (4), having a rear face mounted above a front face of the support and a front face opposite its rear face, and an encapsulation block (8, 8a, 26a) at least partial of the component above the front face of the support, device further comprising at least one heat dissipation element comprising a flexible sheet (11) a plurality of successive portions, in which at least two portions (12, 13) are joined by a fold and are at least partially opposite each other, a first portion (12) of said flexible sheet being fixed at least locally to the front face of said component and a second portion (13) being fixed at least locally to the first portion or to the front face of said support.