Flexible Heat Spreader Thermal Modulation via Piezo Actuator
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic devices face challenges in heat dissipation due to miniaturization and power consumption, leading to increased temperatures that can cause user discomfort and potential device malfunction, as they struggle to maintain both junction and skin temperature limits effectively.
Innovation Solution
An electronic device with a flexible heat spreader and a piezo electric actuator that modulates thermal impedance by creating an air gap or thermal contact between the heat spreader and integrated circuit, controlled by a controller to manage temperatures within specific limits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling fan is used to dissipate heat, then heat dissipation performance is improved, but device size increases and power consumption increases
Solution Approach 1:
The patent extracts the cooling function from a traditional fan-based system and implements it through a phase change material layer that actively migrates to absorb heat. This removes the need for mechanical cooling components, thereby reducing device volume while maintaining effective heat dissipation.
Solution Approach 2:
The patent replaces the mechanical cooling system (fan) with a passive thermodynamic system using phase change materials. The PCM undergoes phase transition and migration driven by thermal gradients, eliminating mechanical moving parts and reducing device complexity and size.
2Temperature
If a cooling fan is used to dissipate heat, then heat dissipation performance is improved, but power consumption increases
Solution Approach 1:
The phase change material system is self-regulating and requires no external power input. The PCM automatically migrates toward the heat source when temperature increases, absorbs heat through phase change, and returns to its original position when cooling occurs, creating a closed-loop passive cooling system.
Solution Approach 2:
The patent replaces the electrically-powered fan with a thermodynamically-driven phase change system, eliminating continuous power consumption associated with mechanical cooling while maintaining effective heat dissipation through passive thermal management.
3Temperature
If heat is dissipated through the exterior housing, then heat dissipation is improved, but user comfort deteriorates due to high surface temperature
Solution Approach 1:
The patent segments the thermal management function into two distinct zones: an internal region where the PCM absorbs heat from the chipset, and an external surface that remains thermally isolated and cool to the touch. This spatial segmentation allows simultaneous achievement of effective heat dissipation and user comfort.
Solution Approach 2:
The phase change material acts as a thermal intermediary that absorbs heat internally through phase transition while preventing this heat from reaching the exterior housing surface. The PCM migrates to create a thermal barrier, mediating between the heat-generating component and the user-contact surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages both junction and skin temperatures, reducing user discomfort and preventing device malfunction by dynamically adjusting thermal impedance to dissipate heat efficiently.
Implementation Method 1
an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode
Implementation Method 2
When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit
Implementation Method 3
When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit
Data Source
AI summary
An electronic device includes an integrated circuit, a flexible heat spreader, an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode. When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit. When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit.