Flexible Interconnect Layer Gap for Camera Module Assembly

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Solution Overview

Problem

The existing manufacturing process for camera modules in electronic devices is inefficient and costly due to the use of prefabricated flexible connector components, which require expensive machinery and increase production time, especially in mass production settings.

Innovation Solution

The image sensing device incorporates a flexible interconnect layer with a substrate and electrically conductive traces, coupled to an interconnect layer via solder bodies, allowing for a gap that enables flexibility and a more reliable electrical connection, and can include surface-mounted electronic components, reducing the need for complex machinery and lowering production costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a prefabricated flexible connector component is used, then the electrical connection reliability is improved, but the manufacturing cost increases and production time is extended

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidproduction efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The flexible interconnect layer is segmented into multiple layers (first flexible interconnect layer and second flexible interconnect layer) separated by a cavity, allowing each layer to be manufactured and tested independently before final assembly. This segmentation enables parallel processing and reduces the overall manufacturing cycle time while maintaining connection reliability through multiple bonding interfaces.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The flexible interconnect layers are pre-assembled with the image sensor IC and pre-tested before being integrated into the final camera module. This preliminary assembly and testing approach allows defects to be detected early in the manufacturing process, reducing rework and improving overall production efficiency while ensuring reliable electrical connections.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If a prefabricated flexible connector component is used, then the electrical connection reliability is improved, but the manufacturing cost increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The flexible interconnect layers are merged with the image sensor IC in a single integrated assembly process, eliminating the need for separate prefabricated connector components. This merging approach reduces the number of discrete parts, simplifies the bill of materials, and lowers manufacturing costs while maintaining reliable electrical connections through direct bonding.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The flexible interconnect layers serve multiple functions: providing electrical connections, enabling bending flexibility, and acting as a structural support for the image sensor IC. This multi-functionality eliminates the need for separate connector components, reducing overall manufacturing cost while maintaining connection reliability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If the interconnect layer is made rigid for stable connections, then the electrical connection stability is improved, but the flexibility and adaptability of the device is reduced

Engineering Contradiction:

Improveconnection stabilityVSAvoiddevice flexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The interconnect structure transitions from a static rigid connection to a dynamic flexible connection that can adapt to different configurations. The flexible interconnect layers enable the device to bend and conform to different shapes while maintaining stable electrical connections through the cavity-separated multi-layer architecture that provides both flexibility and connection stability.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The connection stability is achieved not in the planar dimension but through the third dimension with the cavity-separated multi-layer structure. The flexible interconnect layers are stacked with a cavity between them, providing stable vertical bonding interfaces while maintaining horizontal flexibility for device adaptation.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies and cost-reduces the manufacturing process by using standard, low-cost surface mounting techniques, enhancing production efficiency and reliability of electrical connections while maintaining module performance.

Implementation Method 1

a plurality of solder bodies coupling the interconnect layer and the flexible interconnect layer

Methodology Applied

Scientific EffectSoldering: Soldering

Data Source

PatentUS9455292B2Image sensing device with interconnect layer gap

Publication Date: 2016.09.27 STMICROELECTRONICS INT NV

AI summary

An image sensing device may include an interconnect layer, an image sensor IC coupled to the interconnect layer and having an image sensing surface, and an IR filter aligned with the image sensing surface opposite the interconnect layer. The image sensing device may include a flexible interconnect layer aligned with the interconnect layer and having a flexible substrate extending laterally outwardly from the interconnect layer, and electrically conductive traces on the flexible substrate. The image sensing device may also include solder bodies coupling the interconnect layer and the flexible interconnect layer and also defining a gap between the interconnect layer and the flexible interconnect layer.