Flexible Interposer With Dual Redistribution Layers
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Solution Overview
Problem
Current additive manufacturing processes, such as 3D printing, are limited in forming attachment features smaller than 30 μm for semiconductor devices on flexible hybrid electronics (FHE) boards, restricting the integration of semiconductor devices with FHE boards due to peripheral pitch limitations.
Innovation Solution
A method involving a flexible interposer with a first redistribution layer, where the first layer is deposited via chemical or physical deposition in a clean room environment and a second redistribution layer is 3D printed onto the first layer, allowing for attachment features smaller than 30 μm, enabling the attachment of semiconductor devices to FHE boards via a second redistribution layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If additive manufacturing processes are used to form attachment features, then manufacturing flexibility and cost are improved, but manufacturing precision deteriorates due to inability to form features smaller than 30 μm
Solution Approach 1:
The patent divides the manufacturing process into two segments: additive manufacturing for the flexible interposer and conventional semiconductor fabrication for the redistribution layers. This segmentation allows each process to operate in its optimal range, with additive manufacturing providing flexibility and conventional fabrication providing the required sub-30 μm precision for attachment features.
Solution Approach 2:
The flexible interposer acts as an intermediary component between the semiconductor device and the FHE board. It enables the integration of precision features through conventional fabrication processes while maintaining the overall flexibility of the assembly, thus mediating between the conflicting requirements of precision and flexibility.
2Manufacturing precision
If conventional attachment methods are used, then attachment precision is improved, but device complexity increases due to peripheral pitch limitations
Solution Approach 1:
The patent changes the pitch parameter by using the flexible interposer to accommodate smaller pitch requirements. The interposer enables attachment features with pitch smaller than 30 μm through conventional fabrication, thereby changing the pitch parameter from the additive manufacturing limit to a finer scale compatible with semiconductor devices.
3Adaptability or versatility
If flexible materials are used for the interposer, then flexibility is improved, but structural strength deteriorates
Solution Approach 1:
The flexible interposer is constructed from composite materials that combine flexibility with structural strength. This allows the interposer to maintain its flexible nature while providing sufficient mechanical strength to support the semiconductor device and withstand assembly and operational stresses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the integration of semiconductor devices with FHE boards, providing flexible interposer assemblies that can withstand bending stress, ensuring reliable electrical connections and overcoming the size limitations of existing additive manufacturing processes.
Implementation Method 1
The first redistribution layer may be deposited via chemical deposition or physical deposition. Chemical deposition may include plasma enhanced chemical vapor deposition, atomic layer deposition, molecule layer deposition
Implementation Method 2
Physical deposition may include physical vapor deposition, thermal evaporation, sputtering deposition
Implementation Method 3
The second redistribution layer may be deposited onto the first redistribution layer via additive manufacturing. The additive manufacturing may include 3D printing the flexible interposer
Implementation Method 4
The flexible interposer may be comprised of one of acrylonitrile butadiene styrene, polylactic acid, high impact polystyrene, thermoplastic polyurethane, polydimethylsiloxane, epoxy-based negative photoresist, liquid crystal polymer
Data Source
AI summary
A semiconductor device assembly and method of providing a semiconductor device assembly. The method includes providing a flexible interposer, providing a first redistribution layer on the flexible interposer, and providing a second redistribution layer on a portion of the first redistribution layer. The second redistribution layer is provided by additive manufacturing. The first redistribution layer may be deposited in a clean room environment. The first redistribution layer may be deposited via chemical deposition or physical deposition. A semiconductor device is attached to the first redistribution layer. The flexible interposer may be attached to a board with the semiconductor device being electrically connected to the board via the first redistribution layer, the flexible interposer, and the second redistribution layer. The flexible interposer may be attached to a flexible hybrid electronic (FHE) board. The flexible nature of the flexible interposer and/or the FHE board may redistribute stress on the semiconductor device assembly.