Flexible LED Display Panel Bonding Enhancement Structure
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Solution Overview
Problem
Flexible Micro-LED display panels face issues with Micro-LED units peeling off due to stress and weak bonding during multiple bending, as the existing bonding force is insufficient to withstand the stress generated by the first electrode structure.
Innovation Solution
A flexible LED display panel design that incorporates a bonding enhancement structure, such as an electrical contact layer with hollowed regions or strip-shaped grooves, to buffer stress and enhance bonding stability between the first electrode structure and the LED unit, thereby improving the bonding force and preventing peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple Micro-LED units are arranged in an array on a flexible substrate by bonding, then the display resolution and brightness are improved, but the bonding stability deteriorates during multiple bending due to large stress and weak bonding force
Solution Approach 1:
The bonding enhancement structure is divided into multiple bonding enhancement units arranged in an array, corresponding to the Micro-LED unit array. Each bonding enhancement unit provides localized stress buffering and bonding reinforcement, allowing the structure to maintain both high resolution (through fine-pitch arrangement) and bonding stability (through distributed stress management).
Solution Approach 2:
The bonding enhancement structure is selectively positioned at critical bonding positions between the first electrode structure and Micro-LED units. The structure has different properties in different regions: it provides mechanical stress buffering where needed while maintaining electrical conductivity in conductive regions, thus improving bonding stability without compromising display brightness.
2Strength
If the first electrode structure is made larger to improve electrical connection, then the bonding force is enhanced, but the stress during bending increases causing Micro-LED units to peel off
Solution Approach 1:
The bonding enhancement structure is pre-positioned between the first electrode structure and Micro-LED units to provide beforehand cushioning against bending stress. This structure absorbs and distributes the stress that would otherwise concentrate at the bonding interface, preventing peeling while maintaining strong bonding force.
Solution Approach 2:
The bonding enhancement structure employs composite material characteristics, combining conductive materials (for electrical connection) with materials having appropriate mechanical properties (for stress buffering). This composite approach allows simultaneous enhancement of bonding force and reduction of bending stress.
3Reliability
If the bonding structure is made more complex to improve bonding stability, then the peeling resistance is enhanced, but the device complexity increases
Solution Approach 1:
The bonding enhancement structure serves multiple functions simultaneously: it provides mechanical stress buffering, enhances bonding force, maintains electrical conductivity, and supports the Micro-LED units. This multi-functionality achieves improved peeling resistance without proportionally increasing structural complexity, as a single integrated structure performs all these roles.
Solution Approach 2:
The bonding enhancement structure acts as an intermediary element between the first electrode structure and Micro-LED units. This intermediary provides a dedicated interface that manages stress and bonding without requiring complex modifications to either the electrode structure or the Micro-LED units themselves, thus improving peeling resistance with minimal increase in overall device complexity.
Data Source
AI summary
A flexible light emitting diode (LED) display panel and an electronic device are provided. A bonding enhancement structure is arranged in the flexible LED display panel, so that a stress generated by a first electrode structure on a flexible substrate during bending can be reduced, a bonding force between the first electrode structure and the bonding enhancement structure can be enhanced, and thus bonding stability of an LED unit can be improved. The flexible LED display panel is applied in the electronic device, so that the LED unit does not easily peel off, and display effect and service life of the electronic device can be greatly improved.