Flexible LED Device Using Silicon Microcolumns and Polymer Resin
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Solution Overview
Problem
Conventional LED devices are rigid, limiting their flexibility and applicability, and their manufacturing processes are complex, making it difficult to produce large-sized flexible displays.
Innovation Solution
A flexible LED device is manufactured by patterning a p-type silicon wafer to form microcolumns, filling gaps with a soft polymer resin, and forming an n-type doped metal oxide layer, followed by transferring the structure onto a flexible substrate, maintaining the semiconductor properties while achieving flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional inorganic semiconductor LEDs are used, then LED performance is improved, but the device becomes rigid and cannot be bent
Solution Approach 1:
The patent uses a composite structure combining inorganic semiconductor microcolumns (for high-performance light emission) with organic polymer matrix (for flexibility). The inorganic semiconductor material maintains excellent light emitting properties while the organic polymer provides flexible characteristics, allowing the LED to be bent without breaking.
Solution Approach 2:
The inorganic semiconductor material is divided into microcolumn structures with diameters of 1-100 micrometers. This segmentation reduces the overall rigidity of the semiconductor material while maintaining its light-emitting functionality, enabling the LED to achieve flexibility through the distributed microcolumn architecture.
2Adaptability or versatility
If OLEDs are used to achieve flexibility, then flexibility is improved, but manufacturing process complexity increases and large-sized display production becomes difficult
Solution Approach 1:
The patent applies different material properties to different regions: inorganic semiconductor microcolumns are used in the active light-emitting regions where high performance is needed, while the surrounding matrix and non-active regions use flexible organic polymers. This localized application of materials achieves flexibility without sacrificing LED performance and simplifies manufacturing compared to full OLED structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible LED device can be used in various applications, manufactured with a simpler process, and is energy-efficient, overcoming the limitations of rigid LED devices and complex production methods.
Implementation Method 1
Light emitting diodes are semiconductor light emitting devices which convert electrical energy to light energy. LEDs, like ordinary diodes, includes a p-n junction, and emit light using semiconductor as a light emitting material. Holes from a p-region and electrons from an n-region combine in semiconductor material, such that excess energy is released and photons are emitted.
Data Source
AI summary
The present disclosure provides a flexible light emitting diode (LED) device and a method for manufacturing the same. The method includes providing a p-type silicon wafer as a base, and then performing an exposure and development process to form a patterned layer including a plurality of p-type silicon microcolumns on the base; filling a plurality of gaps among the p-type silicon microcolumns with a soft polymer resin to form a compound layer; sequentially forming an n-type doped metal oxide layer and a first metal electrode layer on the compound layer; and removing the base, forming a second metal electrode layer, and then entirely shifting a whole body including these layers onto a flexible substrate.