Liquid Cooling System With Flexible Links For Electronic Boards
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current liquid cooling systems for electronic boards, particularly in supercomputers, face inefficiencies due to the stiffness of copper pipes, limited air circulation, and high complexity and cost, which hinder effective heat dissipation and processor accessibility.
Innovation Solution
A fully liquid cooling system with a cold plate and flexible thermal sinks connected via a secondary circuit, utilizing a monophasic heat sink with a thermoconductive cooling block to efficiently distribute heat transfer fluid directly to high electronic components, ensuring thermal efficiency and mechanical compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If copper pipes are used for liquid cooling, then thermal conductivity is improved, but mechanical flexibility and ease of disassembly deteriorate
Solution Approach 1:
The cooling system is divided into modular components: a cold plate with integrated channels and separate heat sinks that can be independently assembled and disassembled. This segmentation allows the rigid cold plate to maintain thermal efficiency while the modular heat sinks provide flexibility for quick processor removal and replacement.
Solution Approach 2:
A flexible intermediate connection system is introduced between the rigid copper cold plate and the heat sinks. This intermediary component transmits coolant while accommodating mechanical flexibility, resolving the contradiction between the rigidity needed for thermal conductivity and the flexibility needed for easy disassembly.
2Temperature
If a cold plate interfaces with all electronic components, then cooling coverage is improved, but processor accessibility deteriorates
Solution Approach 1:
The cooling system separates the cooling function for processors from other electronic components. The cold plate provides cooling to lower components, while dedicated heat sinks with flexible connections provide cooling to processors without obstructing access to the processor sockets.
Solution Approach 2:
The cooling architecture transitions from a two-dimensional plane cooling approach to a three-dimensional hierarchical structure, with the cold plate forming a base cooling layer and heat sinks providing elevated cooling zones for processors, allowing both comprehensive cooling and processor accessibility.
3Temperature
If multiple heat pipes are used for processor cooling, then thermal performance is improved, but mechanical rigidity and system complexity increase
Solution Approach 1:
Multiple heat pipe functions are merged into an integrated heat sink assembly that combines the thermal conduction paths, phase change chambers, and heat dissipation structures into a single modular unit. This reduces the number of separate thermal interfaces and simplifies the overall system while maintaining effective processor cooling.
4Temperature
If conductive grease is used for thermal contact, then thermal conductivity is improved, but temperature gradient and manufacturing complexity increase
Solution Approach 1:
The conductive grease layer is extracted and replaced by direct mechanical contact surfaces with integrated thermal pathways. The heat sink designs incorporate built-in thermal conduction mechanisms through rigid bonds and direct metal-to-metal contacts, eliminating the need for external thermal interface materials and simplifying manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides enhanced cooling for all electronic components, maintains processor accessibility, and reduces temperature by up to 10°C compared to prior art, while simplifying manufacturing and assembly, and ensuring reliable connections after multiple disassembly cycles.
Implementation Method 1
A through slot located in the intermediate portion for homogeneously distributing the flow of said heat transfer fluid from the upper part as a jet centered towards
Implementation Method 2
a central portion, hollow with a zone provided with fins or pins to generate turbulence in the flow regime of said heat transfer fluid
Implementation Method 3
a cold plate which is a plate made of a conductive thermal material... a cooling block made of thermoconductive material
Implementation Method 4
a primary cooling circuit with main channels inside which circulates a heat transfer fluid... a secondary circuit of flexible secondary channels
Data Source
Figure 1~3
Figure 4~5
Figure 6
AI summary
The present invention relates to a liquid cooling system 1 for an electronic card 3 consisting of a cold plate 11 and heat sinks 12 connected by flexible links with said cold plate 11.