Flexible Memory Card With Anisotropic Conductive Film
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current memory card systems with flexible integrated circuit device packages lack the necessary adhesive strength and complexity in configuration to be effectively bent or folded for various electronic applications.
Innovation Solution
A memory card system comprising a flexible integrated circuit device package with a connection pad, anisotropic conductive film, and flexible upper and lower cases, which allows for electrical connection and improved adhesive strength through thermal compression, enabling the system to be bent or folded arbitrarily.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible materials are used for the integrated circuit device package, then the system can be bent or folded as desired, but the adhesive strength is insufficient
Solution Approach 1:
An anisotropic conductive film is introduced as an intermediary layer between the flexible integrated circuit device package and the upper flexible case. This film provides both adhesive bonding and electrical connectivity functions, eliminating the need for separate adhesion members and resolving the contradiction between flexibility and adhesive strength.
Solution Approach 2:
The patent combines multiple functions into the anisotropic conductive film: it serves as both the adhesion member for bonding flexible components and as the electrical connection medium. This merging of functions simplifies the overall structure while maintaining both flexibility and sufficient adhesive strength.
2Strength
If multiple adhesion members are used to ensure adhesive strength, then the bonding is improved, but the configuration becomes complex
Solution Approach 1:
The anisotropic conductive film integrates both adhesion and electrical connection functions into a single component, eliminating the need for separate adhesion members. This merging reduces structural complexity while maintaining adequate adhesive strength for flexible components.
Solution Approach 2:
The anisotropic conductive film performs multiple functions simultaneously: it bonds the flexible integrated circuit device package to the upper flexible case, provides electrical connectivity between connection pads, and maintains the flexibility required for bending applications. This multi-functionality simplifies the overall configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves enhanced adhesive strength and a simpler configuration, allowing for flexible use in various electronic devices without additional adhesion members, ensuring structural stability and ease of integration.
Implementation Method 1
an anisotropic conductive film disposed between the flexible integrated circuit device package and the upper flexible case for electrically connecting the connection pad with the connection wiring
Data Source
AI summary
A memory card system may include a flexible integrated circuit device package, an upper flexible case, a lower flexible case, a wiring structure, an anisotropic conductive film, etc. The flexible integrated circuit device package may include a material capable of being bent or folded and a flexible integrated circuit device having a connection pad for an electrical connection. The upper flexible case may include a material capable of being bent or folded and may cover the integrated circuit device package. The lower flexible case may include a material capable of being bent or folded and the flexible integrated circuit device package may be fixed to the lower flexible case. The wiring structure may include a material capable of being bent or folded, and also may include a connection wiring disposed on an inner surface of the upper flexible case for electrically connecting the flexible integrated circuit device package with an external device, a connection pin disposed on an outer surface of the upper flexible case, and a via wiring passing through the upper flexible case. The anisotropic conductive film may be disposed between the flexible integrated circuit device package and the upper flexible case for electrically connecting the connection pad with the connection wiring.