Flexible Midplane Architecture for Multi-Processor Cooling
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Solution Overview
Problem
Traditional backplanes in multi-processor computer systems hinder effective airflow due to their rigid, two-dimensional design, limiting cooling efficiency and circuit routing options, and making it difficult to achieve front-to-back or back-to-front airflow.
Innovation Solution
The implementation of flexible midplanes with bent side sections and a middle section, allowing for orthogonal bending, which facilitates effective front-to-back and back-to-front airflow while maintaining access to circuit boards without disassembly, using materials like FR4 and Kapton for flexibility and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a rigid, two-dimensional backplane is used, then structural stability is improved, but airflow efficiency deteriorates
Solution Approach 1:
The backplane is divided into multiple rigid sections connected by flexible regions. Each rigid section maintains structural stability while the flexible regions between them allow the backplane to bend and create airflow channels, enabling front-to-back cooling airflow patterns.
Solution Approach 2:
The backplane transitions from a completely rigid structure to a semi-flexible structure with designated flexible regions. These regions allow controlled bending to create three-dimensional airflow passages while the rigid sections maintain overall structural integrity and support for circuit boards.
2Ease of manufacture
If a rigid, two-dimensional backplane is used, then manufacturing simplicity is improved, but circuit routing flexibility deteriorates
Solution Approach 1:
The backplane is segmented into rigid sections for manufacturing and assembly, connected by flexible regions that provide routing flexibility. This segmentation allows standard manufacturing processes for rigid sections while the flexible regions accommodate various circuit board configurations and routing requirements.
Solution Approach 2:
Flexible regions are incorporated into the backplane structure using flexible printed circuit board techniques. These flexible regions allow the backplane to be bent into three-dimensional configurations, expanding circuit routing options while maintaining ease of manufacture through established FPCB processes.
3Strength
If a traditional backplane arrangement is used, then structural integrity is improved, but accessibility of circuit boards deteriorates
Solution Approach 1:
The backplane transitions from a two-dimensional flat structure to a three-dimensional bent structure. This dimensional change allows circuit boards to be accessed from the front while the backplane extends backward to connect with rear components, improving accessibility without compromising structural integrity through proper support at key locations.
4Productivity
If cooling airflow is forced up or down through the cabinet, then front-to-back cooling is achieved, but airflow impedance increases
Solution Approach 1:
The backplane is bent into curved or angled configurations to create smooth airflow passages from front to back. These curved pathways reduce turbulence and impedance compared to forcing air through vertical up/down paths, allowing more efficient cooling airflow with less resistance.
Data Source
AI summary
A flexible midplane comprises: a printed circuit board including: a middle section and at least one side section; and a flexible region disposed between the middle section and each side section; wherein each flexible region permits the corresponding side section to be bent in relation to the middle section.