Flexible Motor Coil Substrate with Multi-Surface Wiring
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Solution Overview
Problem
Existing coil substrates for motors have a low space factor and wiring density, which limits the torque and efficiency of motor performance.
Innovation Solution
A coil substrate design featuring a flexible substrate with coils positioned in a raw configuration, where each coil has a center space and surrounding wirings on both surfaces, with via conductors connecting them, and specific overlapping patterns to increase wiring density and space factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If coils are arranged in a conventional single-layer configuration on the flexible substrate, then the manufacturing process is simple, but the space factor and wiring density are low
Solution Approach 1:
The patent transitions from a single-layer coil arrangement to a three-dimensional multi-layer configuration where coils are formed on both the first and second surfaces of the flexible substrate. This dimensional expansion allows wirings to be positioned at different heights and depths, significantly increasing wiring density and space factor while maintaining manufacturing feasibility through standard multi-layer PCB techniques
Solution Approach 2:
The patent implements nested coil structures where coils on the first surface and coils on the second surface are positioned to overlap or interleave with each other. The wirings are arranged such that some coils are embedded within or adjacent to other coils in the vertical dimension, creating a nested configuration that maximizes the use of available space and increases effective wiring density
2Adaptability or versatility
If the flexible substrate uses a rigid structure for coil support, then the coil positioning precision is high, but the flexibility and adaptability of the substrate is reduced
Solution Approach 1:
The patent employs a flexible substrate made of thin film material that can bend and conform to different shapes while maintaining structural integrity. The coil wirings are formed directly on this flexible substrate using printed circuit board techniques, allowing the substrate to remain flexible for motor assembly adaptability while the printed wiring patterns ensure precise coil positioning through controlled manufacturing processes
3Quantity of substance
If coils are densely packed to increase space factor, then the motor torque increases, but the heat dissipation becomes more difficult
Solution Approach 1:
The patent utilizes the third dimension (vertical depth) by forming coils on both surfaces of the flexible substrate and positioning wirings at different depths. This multi-layer arrangement increases the effective space factor and wiring density while creating channels and pathways for heat to dissipate vertically between layers, preventing heat accumulation even in densely packed configurations
Data Source
AI summary
A coil substrate includes a flexible substrate, and coils formed on the flexible substrate such that the coils are positioned substantially in a raw and that each coil has a center space and wirings surrounding the center space. The coils are formed such that each coil includes first wirings on a first surface of the flexible substrate, second wirings on a second surface of the flexible substrate on the opposite side with respect to the first surface, and via conductors penetrating through the flexible substrate and connecting the first and second wirings, and the coils are positioned such that a m-th coil has the second wirings positioned below the center space of a (m+1)-th coil and that a (m+2)-th coil has the first coils positioned on the center space of a (m+1)-th coil, where in is an integer equal to or greater than 1.