Flexible Electronic Package Bending Radius Compatibility
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Solution Overview
Problem
Flexible electronic package devices face issues of poor yield and short service life due to damage from bending and curvature, as they tend to be easily damaged or fall off when applied to curved surfaces.
Innovation Solution
A fabrication method that determines a tolerable bending radius for flexible electronic package devices by comparing it to the minimum surface curvature radius of the applied carrier, ensuring the device is not damaged by curving stress, and redesigning if necessary to ensure compatibility, thereby preventing damage from uneven surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible electronic package devices are applied to curved surfaces, then adaptability is improved, but reliability deteriorates due to damage from bending stress
Solution Approach 1:
The patent applies preliminary action by calculating the tolerable bending radius and minimum surface curvature radius before applying the flexible electronic package device to the curved surface. This pre-assessment ensures that the device's bending tolerance matches the carrier's curvature, preventing damage before it occurs and extending service life while maintaining adaptability to curved surfaces
2Ease of operation
If flexible electronic package devices are made more flexible, then ease of operation is improved, but strength deteriorates making them easier to damage
Solution Approach 1:
The patent applies parameter changes by establishing quantitative relationships between bending radius and material properties. By calculating the tolerable bending radius based on the device's mechanical properties and comparing it with the carrier's minimum surface curvature radius, the patent optimizes the flexibility-strength balance, allowing the device to be flexible enough for curved surfaces while maintaining sufficient strength to resist damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures the flexible electronic package devices are not easily damaged when applied to curved surfaces, enhancing manufacturing yield and extending their service life by ensuring the tolerable bending radius is within the device's stress tolerance.
Implementation Method 1
a curving stress value of each of the members in the flexible electronic package device at the bending radius is calculated
Data Source
AI summary
A fabrication method of a flexible electronic package device including the following steps is provided. A tolerable bending radius of the flexible electronic package device is obtained. A minimum surface curvature radius of a selected portion of an applied carrier is obtained. A relationship of the tolerable bending radius being smaller than the minimum surface curvature radius is ensured. The flexible electronic package device is disposed on the selected portion.