Flexible Panel Through Hole Formation via Column Mold
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Solution Overview
Problem
Existing methods for manufacturing flexible panels often result in thermal damages, such as chars or cracks, and cutting marks on the edges of through holes due to redundant laser energy or cutter wheel cutting, affecting the precision and quality of the molded product.
Innovation Solution
A method involving the formation of a column on a carrier substrate, followed by a flexible layer surrounding the column, and subsequent removal of the column and carrier substrate to create a through hole without chars, cracks, or cutting marks, using a release layer to facilitate easy separation and a heat treatment process to shape the flexible layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser irradiation or cutter wheel cutting is used to form a hole, then the hole can be formed efficiently, but thermal damages such as chars or cracks and cutting marks are formed on the edge of the through hole
Solution Approach 1:
A column structure is formed on the carrier substrate before forming the flexible layer. This preliminary column serves as a mold that defines the through hole shape, allowing the flexible layer to be formed around it. When the column is later removed, a clean through hole is created without thermal damage or cutting marks, as the hole shape was predetermined by the column rather than created by damaging processes.
Solution Approach 2:
The column acts as an intermediary object between the carrier substrate and the flexible layer. It provides a physical template that guides the formation of the through hole, enabling the flexible layer to conform to the desired hole shape without direct contact between cutting tools and the flexible material, thereby avoiding thermal and mechanical damage.
2Productivity
If laser irradiation is used to form a through hole, then the hole can be created quickly, but redundant laser energy causes thermal effects that damage the edge of the region
Solution Approach 1:
The column is formed in advance on the carrier substrate to define the through hole geometry. This preliminary structure eliminates the need for subsequent laser drilling or cutting operations on the flexible layer, as the through hole is created by removing the column after the flexible layer has been formed around it, thereby avoiding thermal damage entirely.
Solution Approach 2:
The invention replaces thermal-based hole formation methods (laser irradiation) with a mechanical approach where a column is formed and then removed. This substitution eliminates the thermal effects associated with laser processing while maintaining the ability to create precise through holes in the flexible layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents thermal damages and ensures a smooth cross-section of the through hole, enhancing the precision and quality of the flexible panel by avoiding thermal and cutting-related defects.
Implementation Method 1
performing a heat treatment process on the flexible material layer
Data Source
AI summary
A method for manufacturing a flexible panel is provided, and the method includes following steps. A column is formed on a carrier substrate. A flexible layer is formed on the carrier substrate, where at least a part of a side surface of the column is surrounded by the flexible layer, so as to form a through hole in the flexible layer. A component layer is formed on the flexible layer, and the column and the carrier substrate are removed. No chars, cracks, and cutting marks are formed on an edge of the through hole of the flexible panel.