Flexible PCB Integrated Circuit Routing in Lithography
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Solution Overview
Problem
The installation space constraints in lithography apparatuses pose challenges for the placement of integrated circuits, leading to potential disturbances such as heat and electromagnetic interference, and signal integrity issues due to long electrical connection lengths.
Innovation Solution
An optical system with a printed circuit board having at least one flexible region, where a flexible component comprising an integrated circuit is arranged, allowing for increased flexibility and the ability to install integrated circuits in a bent state, thereby minimizing disturbances and signal path lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If integrated circuits are installed on printed circuit boards in lithography apparatuses, then electrical connection and control functions are achieved, but installation space constraints and signal integrity issues arise due to long transmission paths
Solution Approach 1:
The patent transitions from rigid, planar printed circuit boards to flexible printed circuit boards that can be bent and routed in three-dimensional space. This allows electrical connections to follow optimized paths around optical elements and through the vacuum chamber, significantly reducing transmission path lengths while navigating the constrained installation space of the lithography apparatus.
Solution Approach 2:
The patent introduces flexibility to the printed circuit board structure, allowing it to be dynamically routed and positioned within the lithography apparatus. The flexible PCB can be bent, folded, and positioned to minimize electrical connection lengths between integrated circuits and actuator/sensor devices, while maintaining electrical connectivity and adapting to the apparatus's spatial constraints.
2Ease of operation
If integrated circuits are placed outside the lithography apparatus to avoid installation space constraints, then installation flexibility is improved, but transmission path length increases and signal integrity deteriorates
Solution Approach 1:
The patent employs flexible printed circuit boards that can be bent and routed through the vacuum chamber and around optical elements. This flexibility allows the PCB to be installed within the compact lithography apparatus while maintaining short electrical connection lengths, eliminating the need to place integrated circuits outside the apparatus and the associated long transmission paths.
3Adaptability or versatility
If multiple actuators and sensors are installed in the lithography apparatus, then functional capability is enhanced, but installation space requirements and thermal load increase
Solution Approach 1:
The patent extracts the integrated circuits from traditional rigid PCB locations and relocates them to flexible PCBs that can be positioned in thermally favorable locations within the vacuum chamber. The flexible PCB routing allows ICs to be placed away from sensitive optical elements, reducing thermal coupling while maintaining electrical connectivity to multiple actuators and sensors distributed throughout the apparatus.
Solution Approach 2:
The flexible PCB enables three-dimensional routing of electrical connections, allowing integrated circuits to be positioned in space optimized for thermal management while maintaining connections to multiple actuators and sensors. This spatial flexibility allows heat-generating ICs to be located away from temperature-sensitive optics while still providing control and feedback functions.
Data Source
AI summary
An optical system for a lithography apparatus has an arrangement comprising a printed circuit board having at least one flexible region in which a flexible component comprising an integrated circuit is arranged.