Flexible PCB Thermoforming for Consistent Bending Radius

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Solution Overview

Problem

Current methods for forming flexible printed circuit boards are time-consuming and result in inconsistent bending radii, leading to product performance inconsistencies and inefficiencies.

Innovation Solution

A thermoforming device and method that utilizes a first and second forming mechanism with heating modules, driven by mechanisms in perpendicular directions to rapidly and accurately bend flexible printed circuit boards to a preset shape, using a controller to ensure precise alignment and shape maintenance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If molding method is used to form flexible printed circuit board, then the bent shape can be substantially consistent with expected shape, but the processing and pressure holding time is long causing waste of time

Engineering Contradiction:

Improvebent shape consistencyVSAvoidprocessing and pressure holding time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent changes the physical state parameter of the flexible printed circuit board by applying heat to raise its temperature above the glass transition point, making the material more pliable. This allows the board to be formed into the desired shape more quickly without requiring long pressure holding times, thus resolving the contradiction between shape consistency and processing time.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces the traditional mechanical molding process with a thermoforming process. Instead of relying solely on mechanical pressure and long holding times to maintain shape, the system uses thermal energy to temporarily alter the material's mechanical properties, enabling faster forming while maintaining shape consistency.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Shape

If conventional molding method is used, then bent shape can be achieved, but the flexible printed circuit board will gradually resume its original shape over time

Engineering Contradiction:

Improvebent shapeVSAvoidshape maintenance over time

Core Design Contradiction:

ShapeVSStability of the object's composition

Solution Approach 1:

The patent carefully controls the temperature parameter during the forming process, heating the board to a specific temperature range above the glass transition point. This controlled thermal treatment allows the board to be formed into the desired shape while maintaining shape stability over time, preventing the board from gradually returning to its original shape.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If conventional molding method is used, then forming process is simple, but the bending radius error in batch products is large

Engineering Contradiction:

Improveforming process simplicityVSAvoidbending radius consistency

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent replaces the purely mechanical molding process with a thermoforming process that combines thermal and mechanical actions. The heating element uniformly distributes thermal energy across the board surface, enabling precise control of the forming process and achieving consistent bending radii in batch products while maintaining process simplicity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enables rapid and accurate thermoforming of flexible printed circuit boards with consistent bending radii, improving production efficiency and maintaining the formed shape over time.

Implementation Method 1

at least one of the first forming portion or the second forming portion is provided with a corresponding heating module configured for heat treatment of the flexible printed circuit board

Methodology Applied

Scientific EffectHeating: Heating

Implementation Method 2

heating the flexible printed circuit board to a temperature above a glass transition point of the flexible printed circuit board

Methodology Applied

Scientific EffectGlass transition:

Implementation Method 3

control the second driving mechanism to drive at least one of the first forming mechanism or the second forming mechanism to move relative to each other in a second direction to press the flexible printed circuit board

Methodology Applied

Scientific EffectPressure-induced deformation: Deformation

Data Source

PatentUS12575033B2Thermoforming device and method for flexible circuit board

Publication Date: 2026.03.10 ZTE CORP

AI summary

Disclosed are a thermoforming device and method for a flexible printed circuit board. The thermoforming device may include: a first forming mechanism provided with a first forming portion, the first forming portion being configured to carry the flexible printed circuit board to be processed; a second forming mechanism provided with a second forming portion which matches with the first forming portion, at least one of the first forming portion or the second forming portion is provided with a corresponding heating module configured for heat treatment of the flexible printed circuit board; a first driving mechanism configured to drive the first forming mechanism and the second forming mechanism to be displaced relative to each other in a first direction; a second driving mechanism configured to drive the second forming mechanism and the first forming mechanism to be displaced relative to each other in a second direction perpendicular to the first direction; and a controller.