Flexible Pick Head for Stress-Reduced Semiconductor Bonding
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving high bonding quality and reducing stress concentration during the pick and place process of semiconductor devices onto substrates, due to the iterative reduction of feature sizes and the need for smaller packaging techniques, which can lead to poor bonding and potential damage from stress concentration.
Innovation Solution
A pick and place device with a flexible head having a bonding portion and a neck portion, where the minimum width of the neck portion is substantially smaller than the maximum width of the bonding portion, is used to distribute the bonding force evenly and mitigate stress concentration, utilizing a vacuum system for precise handling and placement of semiconductor devices onto substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional rigid pick and place device is used to place semiconductor devices onto substrates, then the placement speed and precision can be maintained, but stress concentration occurs during bonding leading to poor bonding quality and potential damage
Solution Approach 1:
The pick and place device employs a flexible head assembly with a flexible membrane or thin film structure that can deform to conform to the curvature of semiconductor devices and substrates. This flexibility allows even distribution of bonding forces across the bonding interface, preventing stress concentration and improving bonding quality while avoiding damage to the devices.
Solution Approach 2:
The device utilizes controllable flexibility parameters by adjusting the degree of flexibility of the head assembly through mechanical or material property changes. This allows the system to adapt its compliance level to match different device geometries and bonding requirements, optimizing force distribution and eliminating stress concentration points during the bonding process.
2Strength
If the bonding force is applied concentratedly to achieve strong bonding, then bonding strength can be improved, but stress concentration occurs leading to potential damage to the semiconductor device
Solution Approach 1:
The bonding force application is segmented into multiple distributed contact points across the bonding interface rather than a single concentrated force. The flexible head assembly divides the total bonding force into numerous smaller forces applied simultaneously at different locations, achieving strong overall bonding without creating stress concentration at any single point that could cause device damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the bonding quality of semiconductor devices by reducing stress concentration and ensuring even force distribution, leading to enhanced reliability and reduced risk of damage during the packaging process.
Implementation Method 1
utilizing a vacuum system for precise handling and placement of semiconductor devices onto substrates
Data Source
AI summary
A manufacturing method of a semiconductor package includes the following steps. A semiconductor device is picked up from a carrier by a pick and place device, wherein the pick and place device includes a flexible head having a bonding portion configured to be in contact with the semiconductor device, a neck portion connecting the bonding portion, wherein a minimum width of the neck portion is substantially smaller than a maximum width of the bonding portion. The semiconductor device is placed and pressed onto a substrate by the pick and place device. An encapsulating material is formed over the substrate to laterally encapsulating the semiconductor device. A redistribution structure is formed over the semiconductor device and the encapsulating material. The substrate is removed.