Flexible Polymer Substrate for Rigid Component Integration
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Solution Overview
Problem
Current flexible electronics backplane manufacturing faces challenges such as non-uniformity in substrate surface due to solvent evaporation, poor interfacial adhesion between flexible and rigid components, and mismatched thermal expansion coefficients, leading to delamination and performance issues.
Innovation Solution
A high solute-fraction (>50%) coating solution is used with thiol-click reactions to create substrates with semi-covalent linkages for improved adhesion, and low surface roughness is achieved through slot-die coating with monomeric or oligomeric precursor solutions, enabling better integration with rigid components and thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If slot-die coating is used to deposit thin-films with high uniformity, then manufacturing scalability is improved, but surface uniformity deteriorates due to solvent evaporation
Solution Approach 1:
The patent changes the chemical composition parameters of the coating formulation by incorporating reactive diluents that participate in polymerization reactions. This transforms the traditional solvent-based system into a reactive system where the diluent becomes part of the polymer network, eliminating evaporation-related surface non-uniformity while preserving slot-die coating scalability
Solution Approach 2:
The reactive diluent acts as an intermediary substance that serves dual functions: it maintains the fluidity needed for slot-die coating deposition while simultaneously participating in the polymerization reaction to become part of the final polymer network, thus mediating between the conflicting requirements of processability and surface uniformity
2Adaptability or versatility
If traditional flexible substrates are used, then flexibility is achieved, but interfacial adhesion to rigid components deteriorates
Solution Approach 1:
The patent creates a composite polymer system combining flexible polymer chains with reactive functional groups that can form strong interfacial bonds with rigid components. The flexible backbone maintains adaptability while the reactive groups (such as epoxies, carboxylic acids, or amines) provide strong adhesion to metals and other rigid materials
3Ease of manufacture
If solvated substrate materials are used for slot-die coating, then ease of deposition is improved, but off-gassing during vacuum processing occurs
Solution Approach 1:
The reactive diluent serves as an intermediary that replaces traditional volatile solvents. It maintains the coating solution's processability during deposition but eliminates harmful off-gassing by becoming covalently bonded in the polymer network, thus mediating between ease of deposition and vacuum compatibility
Solution Approach 2:
The patent converts the traditionally harmful effect of using high solvent fractions (which cause off-gassing) into a benefit by using reactive diluents that, instead of evaporating, participate in the polymerization reaction. The substance that would normally be harmful becomes a valuable component of the final polymer structure
4Ease of manufacture
If existing backplane substrates are used for photolithography, then initial fabrication is possible, but alignment reliability deteriorates during thermal cycling
Solution Approach 1:
The patent modifies the thermal parameters of the substrate by selecting polymers with glass transition temperatures and coefficients of thermal expansion specifically tailored for photolithographic processing. This ensures dimensional stability and alignment reliability during the thermal cycling inherent in photolithography while maintaining fabrication capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a flexible substrate with low surface roughness and enhanced interfacial adhesion, allowing for reliable integration of flexible and rigid components, improved thermal management, and increased performance in flexible electronic devices.
Implementation Method 1
slot-die coating with monomeric or oligomeric precursor solutions
Implementation Method 2
thiol-click reactions to create substrates with semi-covalent linkages
Implementation Method 3
the evaporation required for the solid fraction to precipitate and form a continuous film
Data Source
AI summary
Provided are flexible electronics stacks and methods of use. An example flexible electronics stack includes a flexible polymeric substrate film and a rigid inorganic electronic component. The flexible polymeric substrate film includes a thermoset polymer prepared by curing a monomer solution; wherein the monomer solution comprises about 25 wt % to about 65 wt % of one or more thiol monomers and from about 25 wt % to about 65 wt % of one or more co-monomers.