Flexible Push Bonding for Uniform Electronic Component Transfer
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Solution Overview
Problem
Conventional methods for transferring semiconductor devices from a transfer substrate to an objective substrate face challenges in achieving uniform bonding due to difficulties in adjusting coplanar states and ensuring high flatness, leading to time-consuming and costly fabrication processes with non-uniform bonding forces.
Innovation Solution
A transferring apparatus with a flexible push generator, such as a gas-filled airbag, is used to apply even force to the substrates, combined with a laser generator for precise bonding, allowing for controlled alignment and release of electronic components onto the objective substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional direct bonding method is used to bond transfer substrate and objective substrate, then bonding can be achieved, but uniform bonding force cannot be ensured and flatness requirements are high
Solution Approach 1:
A flexible push generator acts as an intermediary between the transfer substrate and objective substrate, providing uniform distributed pressure during bonding. This mediator component compensates for minor flatness variations and ensures even force distribution across the bonding interface, resolving the contradiction between bonding uniformity and substrate flatness requirements.
Solution Approach 2:
The flexible push generator utilizes pneumatic or hydraulic principles to generate controlled, uniform pressure during the bonding process. By using gas or liquid pressure distribution, the system achieves even force application across the substrate interface without requiring extremely high flatness, thus improving bonding uniformity while reducing flatness requirements.
2Productivity
If conventional bonding method is used, then bonding can be achieved, but fabrication is time-consuming and costly
Solution Approach 1:
The flexible push generator is pre-configured and integrated into the bonding system before the actual bonding process. This preliminary setup eliminates the need for time-consuming adjustments during fabrication, as the uniform pressure distribution mechanism is already in place, thereby improving productivity and reducing adjustment time.
Solution Approach 2:
The invention replaces complex mechanical adjustment mechanisms with a more efficient pneumatic or hydraulic push generator system. This substitution eliminates tedious mechanical alignment and pressure distribution adjustments, significantly reducing fabrication time and improving overall productivity while maintaining bonding quality.
3Manufacturing precision
If high flatness is required for substrates, then bonding uniformity can be improved, but manufacturing cost increases
Solution Approach 1:
The flexible push generator serves as a mediator that compensates for substrate flatness variations, allowing bonding to proceed uniformly even with moderate flatness. This eliminates the need for expensive high-precision substrate fabrication, thereby maintaining bonding uniformity while reducing manufacturing costs.
Solution Approach 2:
The invention changes the pressure application parameter from concentrated mechanical force to distributed pneumatic or hydraulic pressure. This parameter change allows for effective bonding with lower substrate flatness specifications, reducing the cost of substrate manufacturing while maintaining bonding uniformity through the flexible push generator's pressure distribution capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures a uniform and effective bonding process, improving manufacturing yield and accuracy in fixing electronic components or light-emitting diodes, while reducing manufacturing costs and tolerances required for substrate flatness.
Implementation Method 1
a flexible push generator, which may generate a flexible push to an objective substrate or a transfer substrate
Implementation Method 2
the flexible push generator includes a gas-filled airbag
Implementation Method 3
an energy beam is applied to the electronic component, so that the electronic component is released from the transfer substrate and bonded on the bonded side of the objective substrate
Data Source
AI summary
A transferring apparatus configured to transfer an electronic component includes a first carrier, a second carrier, an actuator mechanism, and a flexible push generator. The first carrier is configured to carry an objective substrate, and the second carrier is configured to carry a transfer substrate. The actuator mechanism is configured to actuate the first carrier and the second carrier to move close to and away from each other. The flexible push generator is disposed near the first carrier or the second carrier and generates a flexible push to the carried objective substrate or transfer substrate when the first carrier and the second carrier are actuated in a way close to each other. A method of bonding an electronic component and a method for manufacturing a light-emitting diode display are also provided.