Flexible Redistribution Interconnects for Vertical Connections
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Solution Overview
Problem
The challenge in semiconductor packaging is to increase vertical connections while minimizing package size, as existing methods like through-mold-vias (TMVs) and through-silicon-vias (TSVs) are limited by stringent size requirements and costly, and traditional wire bonds restrict the number of connections that can be achieved.
Innovation Solution
A redistribution connection layer is introduced, comprising a flexible layer of copper or similar material sandwiched between dielectric layers, allowing for flexible wrapping around dies and independent formation before attachment, which enables more efficient and reliable vertical connections without the need for TSVs or TMVs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional through-mold-vias (TMVs) and through-silicon-vias (TSVs) are used for vertical connections, then electrical connectivity is achieved, but package size increases and manufacturing cost increases
Solution Approach 1:
The patent transitions from vertical through-silicon-vias to lateral redistribution connections. The connection layer extends laterally from the die edge rather than penetrating vertically through the silicon, changing the dimensional approach from z-axis to x-y plane connectivity. This lateral extension allows connections without increasing package footprint area.
Solution Approach 2:
The connection system is segmented into separate functional layers: the die itself, the separately formed redistribution connection layer, and the substrate. This segmentation allows the connection layer to be optimized independently for lateral routing, achieving high-density connections without the constraints of through-via formation in the die.
2Reliability
If traditional through-mold-vias (TMVs) and through-silicon-vias (TSVs) are used for vertical connections, then electrical connectivity is achieved, but manufacturing cost increases
Solution Approach 1:
The redistribution connection layer is formed separately and preliminarily before die attachment. The connection layer is prepared with its conductive traces and dielectric structures in advance, allowing standard semiconductor fabrication processes to be used rather than costly post-attachment via formation. This preliminary formation significantly reduces manufacturing complexity and cost.
Solution Approach 2:
The separately formed redistribution connection layer acts as an intermediary between the die and the substrate. This intermediate layer absorbs the manufacturing complexity, allowing the die and substrate to be connected through a pre-fabricated connection structure rather than requiring direct through-via formation through the die, thereby reducing overall manufacturing cost.
3Reliability
If traditional wire bonds are used for connections, then electrical connectivity is achieved, but the number of connections is limited
Solution Approach 1:
The redistribution connection layer uses planar conductive traces that can be photolithographically patterned to create multiple parallel connection paths. This copying approach through photomask-based fabrication allows hundreds or thousands of connections to be created simultaneously in a single layer, vastly exceeding the connection capacity of individual wire bonds.
Solution Approach 2:
The patent moves from one-dimensional wire bond connections to two-dimensional planar trace routing in the redistribution layer. This dimensional change allows multiple connections to be packed in parallel within the same lateral space, dramatically increasing the number of simultaneous connections without adding vertical height or requiring multiple bonding operations.
Data Source
AI summary
Electronics devices, having vertical and lateral redistribution interconnects, are disclosed. An electronics device comprises an electronics component (e.g., die, substrate, integrated device, etc.), a die(s), and a separately formed redistribution connection layer electrically coupling the die(s) to the electronics component. The redistribution connection layer comprises dielectric layers on either side of at least one redistribution layer. The dielectric layers comprise openings that expose contact pads of the at least one redistribution layer for electrically coupling die(s) and components to each other via the redistribution connection layer. The redistribution connection layer is flexible and wrap/folded around side edges of die(s) to minimize vertical vias. Various devices and associated processes are provided.