Flexible Semiconductor Device Aggregation for Efficient Handling
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Solution Overview
Problem
Conventional square packages for semiconductor devices are not economical for carrying and sorting, as they do not optimize the arrangement and access for efficient handling and processing.
Innovation Solution
A flexible first layer with a curved shape and a mark, combined with a second layer, allows for the arrangement of semiconductor devices in a circular or polygonal pattern, enabling more efficient handling and alignment for testing and sorting, with the flexibility to accommodate varying numbers of devices and sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor devices are arranged in a square package, then the package structure is simple and easy to manufacture, but the carrying efficiency and space utilization are not economical
Solution Approach 1:
The patent applies curvature by transitioning from a square package layout to a circular arrangement of semiconductor devices. The circular configuration allows for more compact packing and better space utilization, enabling more devices to be carried in the same footprint area while maintaining ease of manufacture through the flexible carrier tape system
2Ease of operation
If semiconductor devices are arranged in a square package, then the package is easy to handle, but the carrying capacity is reduced
Solution Approach 1:
The patent utilizes the flexible carrier tape as an additional dimension for organizing and transporting semiconductor devices. By arranging devices in a circular pattern on a flexible tape that can be wound into a reel, the system achieves both easy handling (through the reel mechanism) and increased carrying capacity (through optimized circular packing)
Solution Approach 2:
The flexible carrier tape serves as a thin film substrate that enables the circular arrangement of devices. This flexible medium allows the devices to be organized in a space-efficient circular pattern while maintaining ease of handling through the tape's flexibility, which can be wound, unwound, and manipulated like conventional reel-to-reel media
Data Source
AI summary
An aggregation of semiconductor devices comprises a first layer, a second layer adhered to the first layer, and a plurality of semiconductor devices arranged between the first layer and the second layer to form a shape, wherein the shape comprises a curve and a mark, and the first layer is flexible.