Flexible Semiconductor Device Laser Opening Resin Film
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Solution Overview
Problem
Conventional methods for manufacturing flexible semiconductor devices face challenges such as high production costs due to the use of expensive quartz substrates, limited flexibility and weight due to glass substrates, and complex peeling processes, which affect the productivity and performance of TFT elements on resin substrates.
Innovation Solution
A method involving the formation of a semiconductor structure on a metal foil, covering it with a resin film, and using laser irradiation to create openings in the resin film for electroconductive members while subjecting the semiconductor structure to heat treatment, improving film quality and TFT performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If glass substrate is used for TFT element formation, then manufacturing process is simplified, but weight increases and flexibility is lost
Solution Approach 1:
The patent replaces expensive, heavy glass substrates with flexible resin substrates that can be processed at lower temperatures. The resin substrate serves as a temporary support during manufacturing that is eventually removed, allowing the TFT structure to be transferred to a flexible final substrate, thus achieving both weight reduction and flexibility while maintaining manufacturing simplicity
Solution Approach 2:
The patent employs flexible resin substrates and thin film structures to replace rigid glass substrates. The TFT elements are formed as thin films on flexible substrates, enabling the final display panel to be lightweight and flexible while maintaining the ease of manufacturing through standardized thin-film deposition processes
2Stability of the object's composition
If glass substrate is used for TFT element formation, then structural stability is maintained, but flexibility and shock resistance deteriorate
Solution Approach 1:
The patent uses flexible resin substrates instead of rigid glass substrates, allowing the TFT structure to maintain stability through proper adhesive bonding and encapsulation while gaining flexibility and shock resistance. The thin film structure of the TFT itself provides structural integrity without requiring rigid substrate support
3Adaptability or versatility
If transference process from glass substrate to resin substrate is used, then flexibility is achieved, but process complexity increases due to peeling steps
Solution Approach 1:
Instead of forming TFTs on glass and then transferring to resin (which requires peeling), the patent inverts the approach by directly forming TFTs on the flexible resin substrate using low-temperature processing. This eliminates the need for peeling and transfer steps, reducing process complexity while maintaining flexibility
Solution Approach 2:
The patent performs preliminary preparation of the resin substrate surface to ensure proper adhesion and low-temperature processing capability before TFT formation. This preliminary action enables direct TFT fabrication on flexible substrates without requiring subsequent peeling or transfer operations
4Adaptability or versatility
If transference process with peeling treatment is used, then substrate flexibility is achieved, but productivity decreases due to additional treatments
Solution Approach 1:
The patent inverts the conventional approach by directly fabricating TFTs on flexible resin substrates at low temperatures, eliminating the need for peeling and additional treatments. This inversion of the manufacturing sequence dramatically improves productivity while maintaining substrate flexibility
Solution Approach 2:
The patent applies preliminary surface treatment and low-temperature processing preparation to the resin substrate, enabling direct TFT formation without subsequent peeling operations. This preliminary action streamlines the manufacturing process and enhances productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the productivity and performance of flexible semiconductor devices by simplifying the manufacturing process, improving semiconductor characteristics, and allowing for the use of lower-cost resin substrates while maintaining high performance.
Implementation Method 1
irradiating the resin film with a laser, and thereby forming an opening in the resin film wherein the surface of the semiconductor structure portion is exposed through the opening; wherein the laser irradiation forms the opening in the resin film, while subjecting the semiconductor structure portion to a heat treatment
Implementation Method 2
subjecting the semiconductor structure portion to a heat treatment
Data Source
AI summary
There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprising a support layer, a semiconductor structure portion formed on the support layer, and a resin film formed on the semiconductor structure portion. The resin film comprises an opening formed by a laser irradiation therein, and also an electroconductive member which is in contact with the surface of the semiconductor structure portion is disposed within the opening of the resin film.