Flexible Semiconductor Package with Stress Absorption

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Solution Overview

Problem

Flexible semiconductor packages often damage memory semiconductor chips due to increased size and deflection, as the chips are subjected to shear stress when bent or curved.

Innovation Solution

A flexible semiconductor package design featuring a flexible substrate with data and control chips, stress absorption members, and a flexible protection member, along with bumps and recesses in the wirings to enhance contact area and absorb shear stress, preventing chip damage during deflection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the size of the semiconductor chip is increased to provide both data storage and processing units, then the functionality is improved, but the chip is damaged more frequently when the substrate is deflected

Engineering Contradiction:

ImprovefunctionalityVSAvoidchip damage resistance

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent divides the large semiconductor chip into separate data storage chips and data processing chips. This segmentation allows each chip to be smaller and more resilient to deflection damage, while the flexible substrate maintains the functional integration of the complete system.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces a flexible substrate as an intermediary between the semiconductor chips and the external environment. This substrate absorbs and distributes the stress from deflection, protecting the chips from direct mechanical damage while maintaining electrical connections through bump structures.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If a molding member with high strength is used to protect the semiconductor chip from external impact, then the protection is improved, but the flexibility of the package is reduced

Engineering Contradiction:

Improveprotection from external impactVSAvoidflexibility

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The patent replaces the traditional rigid molding member with a flexible substrate that provides protection through a different mechanism. The flexible substrate acts as a thin film that distributes mechanical stress across the entire package area, protecting the chips from impact while maintaining the package's ability to bend and deflect.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS8524530B2Flexible semiconductor package and method for fabricating the same

Publication Date: 2013.09.03 SK HYNIX INC

AI summary

A flexible semiconductor package includes a flexible substrate. A data chip is disposed over the flexible substrate. The data chip includes a data storage unit for storing data and first bonding pads that are electrically connected to the data storage unit. A control chip is disposed over the flexible substrate. The control chip includes a data processing unit for processing the data in the data chip and second bonding pads that are electrically connected to the data processing unit. Wirings are formed in order to electrically connect the first bonding pads to the second bonding pads.