Flexible Stripline Cable Assembly for Quantum I/O Thermal Management
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Solution Overview
Problem
The growth in the number of I/Os in quantum computing systems poses challenges such as increased thermal load, difficulty in assembly and disassembly of connectors, and the need for high-density interconnects that are compact and easily connectable.
Innovation Solution
The use of flexible cables with integrated striplines and grounding planes, which are mechanically and thermally connected to isothermal plates, allowing for easy assembly and disassembly, reduced thermal load, and improved mechanical integrity, while providing high-density signal lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of I/Os is increased to support more qubits and components, then the functionality and processing capability are improved, but the thermal load increases and system complexity worsens
Solution Approach 1:
The system is divided into multiple temperature stages (e.g., 4K stage and millikelvin stage) with separate connector assemblies for each stage. This segmentation allows thermal management by keeping I/O connections at appropriate temperature levels, reducing the thermal load on sensitive quantum components while maintaining high I/O capacity.
2Ease of manufacture
If traditional wire bonds and connectors are used for connecting components, then the assembly is straightforward, but the assembly and disassembly of connectors becomes difficult and time-consuming
Solution Approach 1:
The connector assembly incorporates movable and adjustable components that allow for dynamic connection and disconnection. The design enables quick attachment and detachment of I/O connections without requiring complex manual manipulation, significantly reducing assembly and disassembly time while maintaining ease of manufacture.
3Volume of moving object
If high-density interconnects are implemented to reduce space, then the compactness is improved, but the difficulty of detecting and measuring signal integrity increases
Solution Approach 1:
The connector assembly includes intermediary measurement points and test structures integrated into the high-density interconnect architecture. These intermediaries provide accessible measurement locations that allow signal integrity verification without requiring direct access to the densely packed interconnects, thus maintaining compactness while enabling easy detection and measurement.
4Strength
If flexible cables with integrated striplines are used instead of traditional connectors, then the mechanical integrity is improved, but the device complexity increases
Solution Approach 1:
The flexible cable integrates multiple functions (signal transmission, grounding, mechanical support) into a single unified structure with embedded striplines. This merging improves mechanical integrity by eliminating separate connector components and potential connection points of failure, while the integration is achieved through standardized manufacturing processes that manage the device complexity.
Data Source
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AI summary
In some aspects, a flexible cable may comprise: a flexible strip with first and second parallel surfaces and first and second ends, said flexible strip being electrically insulating; a metal stripline within said flexible strip; first and second metallic grounding planes on said first and second surfaces, respectively; and a first circuit board mechanically attached to at least one of said first end of said flexible strip and said first and second metallic grounding planes at said first end, said first circuit board being mechanically stiff, said metal stripline being electrically connected to electrical circuitry on said first circuit board.