Flexible Substrate Air Layer Stress Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Flexible substrates with electrical elements face damage from stress caused by bending and stretching, leading to potential cracking of wiring, which existing measures like honeycomb openings and meandering wiring shapes do not adequately address.
Innovation Solution
Incorporating air layers between the protective member and the wiring lines, along with a wavy pattern for the wiring and island-shaped portions on the insulating base, to reduce stress and increase ductility, thereby preventing cracks and enhancing elongation capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If honeycomb-shaped openings are provided in the substrate or wiring is made into a meandering shape, then flexibility is improved, but stress concentration still occurs leading to wiring damage
Solution Approach 1:
Air layers are introduced between the protective member and the wiring/insulating base beforehand to create a cushioning effect. These air layers act as stress-absorbing buffers that prevent direct stress transmission to the wiring during bending or stretching, thereby preventing cracks before they occur.
Solution Approach 2:
The air layers serve as an intermediary between the protective member and the wiring structure. This intermediary layer decouples the mechanical stress from the wiring, allowing the protective member to withstand external forces while the wiring remains protected from stress concentration.
2Adaptability or versatility
If the substrate is made more flexible to accommodate bending and stretching, then adaptability is improved, but stress on wiring increases causing potential cracking
Solution Approach 1:
Air layers are pre-introduced between the protective member and the wiring structure to provide cushioning during deformation. When the substrate undergoes bending or stretching, these air layers compress and expand, absorbing stress peaks and preventing direct stress transmission to the wiring, thereby maintaining wiring strength during elongation.
Solution Approach 2:
The insulating base and protective member are designed as flexible thin film structures that can deform without damaging the wiring. The combination of these flexible layers with the air layer cushioning system allows the overall structure to accommodate large deformations while protecting the rigid wiring from stress concentration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces stress on the wiring, increases the flexible substrate's elongation rate, and suppresses the occurrence of cracks, thereby improving the durability and reliability of the flexible substrate.
Implementation Method 1
the protective member is separated from at least a part of the first side surface via an air layer and from at least a part of the second side surface via an air layer
Data Source
AI summary
According to one embodiment, a flexible substrate includes a support plate including a first surface, a line portion located on the first surface and including a first side surface and a second side surface on an opposite side to the first side surface and a protective member which covers the line portion, in contact with the first surface. The line portion includes a flexible insulating base located on the first surface and a wiring layer disposed on the insulating base, the protective member is separated from at least a part of the first side surface via an air layer and from at least a part of the second side surface via an air layer, and the air layers extend along the line portion.