Flexible Substrate Identifying Code Placement
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Solution Overview
Problem
Conventional flexible substrates require reversing to interpret identifying codes, increasing interpretation time and making codes difficult to distinguish due to varying positions and small handwriting.
Innovation Solution
A flexible substrate with a base layer, metallic layer, and solder mask layer, where a pre-marked area on the solder mask layer's exposing surface defines the position for the identifying code, using a bottom block to facilitate easy identification and prevent misinterpretation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the identifying code is formed on the second surface of the base layer by printing, then the identifying code can be formed with simple process, but the interpretation time increases and the code is difficult to distinguish
Solution Approach 1:
The identifying code is moved from the second surface (back side) of the base layer to the first surface (front side) by forming it on the solder mask layer. This dimensional relocation allows the code to be viewed from the same side as the circuit board, eliminating the need to reverse the substrate and thereby reducing interpretation time while maintaining simple printing formation process
2Ease of manufacture
If the identifying code is formed on the second surface of the base layer, then the code can be formed away from the circuit traces, but the position varies by manufacturer and the code becomes difficult to distinguish
Solution Approach 1:
A pre-marked area is defined on the solder mask layer at a specific location relative to the circuit traces, providing a standardized position for the identifying code. This localized marking ensures consistent code placement across different manufacturers and inspection systems, improving distinguishability while maintaining manufacturing flexibility
Solution Approach 2:
The solder mask layer serves as an intermediary carrier for the identifying code, positioned between the base layer and the external environment. This intermediary layer provides a stable, standardized surface for code formation that is independent of manufacturer variations, enabling consistent detection and measurement
3Ease of manufacture
If the identifying code is formed on the second surface of the base layer, then the code can be separated from the circuit traces, but the code position varies and requires manual searching
Solution Approach 1:
A pre-marked area is defined on the solder mask layer before the identifying code is formed. This preliminary marking guides the placement of the code in a standardized position relative to the circuit traces, enabling inspection systems to quickly locate the code without manual searching while maintaining separation from the traces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces interpretation time by clearly defining the marked position and preventing misjudgment through the use of a bottom block, making the identifying code more distinguishable and easier to form within the pre-marked area.
Implementation Method 1
the solder mask layer is a material that is pervious to light and comprises an exposing surface
Data Source
AI summary
A flexible substrate includes a base layer, a metallic layer, a solder mask layer and an identifying code, the metallic layer is disposed at a first surface of the base layer, the metallic layer comprises a plurality of traces and at least one bottom block used for defining marked position, wherein the traces and the at least one bottom block are covered with the solder mask layer, wherein above the perpendicular direction of the at least one bottom block of the metallic layer, a pre-marked area is defined on an exposing surface of the solder mask layer and by an outlined edge of the at least one bottom block, and the identifying code is formed within the pre-marked area of the solder mask layer.