Flexible Substrate Driver Chip Placement for Seamless Display Splicing
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Solution Overview
Problem
Existing display panels and devices formed by splicing single display units have a significant proportion of non-display regions, which reduces their effectiveness and increases production costs.
Innovation Solution
The display panel is designed with at least two display units, each comprising a rigid substrate with a display bearing region and splicing regions, a flexible substrate extending beyond the display bearing region, a light-emitting unit circuit layer, and a driver chip. The driver chip is positioned on the flexible substrate or in the splicing region, eliminating the need for additional space on the display screen and allowing for seamless splicing of adjacent units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If driver chips are placed on the display screen area, then electrical connection is achieved, but the display area ratio decreases
Solution Approach 1:
The patent moves the driver chip from the traditional planar position on the display screen to a three-dimensional position on the side surface of the flexible substrate. This dimensional transition allows electrical connections to be established through conductive layers on the side surface, eliminating the need to occupy display area while maintaining manufacturing feasibility.
Solution Approach 2:
The driver chip is extracted from the display bearing region and relocated to the splicing region or side surface of the flexible substrate. This extraction removes the conflicting element from the display area, resolving the contradiction between achieving electrical connection and maintaining high display area ratio.
2Area of stationary object
If display units are spliced together, then larger display panels are formed, but splicing gaps increase the non-display region proportion
Solution Approach 1:
The patent merges the driver chip location with the splicing region, allowing adjacent display units to be connected both electrically and structurally through the same region. This integration eliminates the need for separate connection areas, reducing splicing gaps and improving the overall display region area.
Solution Approach 2:
By placing driver chips on the side surface or in the splicing region rather than on the front display surface, the patent enables a more compact splicing structure that reduces visible gaps between display units, thereby increasing the effective display region area.
3Ease of manufacture
If flexible substrate is extended beyond display region, then driver chip placement space is created, but substrate complexity increases
Solution Approach 1:
The extended portion of the flexible substrate serves multiple functions: it provides mechanical support, contains conductive connection layers for electrical connections, and offers mounting space for driver chips. This multi-functionality justifies the extended structure while improving manufacturability.
Solution Approach 2:
The flexible substrate is functionally segmented into the display bearing region and the extended region. The extended region is specifically designed for housing driver chips and establishing electrical connections, separating these functions from the display area and simplifying the overall design.
Data Source
AI summary
Provided are a display panel and a display device. The display panel includes at least two display units. Each display unit includes a substrate, a flexible substrate, a light-emitting unit circuit layer and at least one driver chip. The rigid substrate includes a display bearing region and a splicing region located on at least one side of the display bearing region. The flexible substrate is located on a first surface of the rigid substrate and located in the display bearing region, and the flexible substrate at least partially extends out of the display bearing region of the rigid substrate. The light-emitting unit circuit layer is located on a surface of one side of the flexible substrate away from the rigid substrate and includes at least one bonding pad.