Flexible Driving Substrate Structure for Bendable LED Splicing
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Solution Overview
Problem
The existing Micro/Mini LED display technology faces challenges in manufacturing large-size LED display substrates due to the limitations of transfer printing, requiring splicing of small-size substrates, which results in complex and thick film layers in the bendable regions that are difficult to bend and prone to connection wire breakage under stress.
Innovation Solution
A driving substrate with a flexible substrate, conductive layers, insulating layers, and a planarization layer with a hollow structure in the bendable region, along with a protection layer, is designed to facilitate bending and reduce stress on connection wires, ensuring the substrate's integrity and wear resistance during manufacturing and use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a bendable region is arranged between the display region and bonding region to reduce splicing gaps, then the distance between display regions in adjacent substrates is reduced, but the film layer in the bendable region becomes complex and thick, making it difficult to bend and prone to connection wire breakage
Solution Approach 1:
The patent segments the film layer structure in the bendable region by removing certain layers (such as the color conversion layer and encapsulation layers) specifically in the bendable region, while maintaining them in the display region. This segmentation allows the bendable region to have a simplified, thinner structure that is easier to bend, while the display region maintains its full protective and functional layers.
Solution Approach 2:
The patent applies different structural qualities to different regions: the bendable region has a simplified structure with fewer layers and reduced thickness to facilitate bending, while the display region maintains the complete multi-layer structure for optimal display performance and protection. This local differentiation resolves the contradiction between bending ease and structural complexity.
2Strength
If the film layer in the bendable region is made complex and thick to ensure protection and functionality, then the structural integrity is improved, but the substrate becomes difficult to bend and connection wires are prone to breakage under stress
Solution Approach 1:
The patent segments the protective structure by removing certain protective layers (color conversion layer, encapsulation layers) specifically from the bendable region while retaining them in the display region. This ensures that the display region maintains full structural integrity and protection, while the bendable region achieves the necessary flexibility for bending operations.
Solution Approach 2:
Different structural qualities are applied locally: the display region maintains a thick, multi-layer structure for optimal protection and display performance, while the bendable region has a thinned, simplified structure that provides sufficient protection while enabling flexible bending without wire breakage.
3Area of stationary object
If small-size LED display substrates are spliced to form large-size substrates, then large-size display substrates can be manufactured, but the splicing process results in complex film layers and increased manufacturing complexity
Solution Approach 1:
The patent performs preliminary action by pre-defining and preparing the bendable region with a simplified structure before the splicing process. This pre-prepared bendable region with reduced film layers facilitates easier alignment and splicing of multiple substrates, reducing the overall complexity of the manufacturing process and enabling efficient production of large-size displays.
Data Source
AI summary
The present disclosure provides a driving substrate, including: a flexible substrate including a display region and a bendable region; a first conductive layer on the flexible substrate and including a first wire in the display region, and a connection wire at least partially in the bendable region; a flexible insulating layer including a first insulation pattern in the display region, and a second insulation pattern in the bendable region; a second conductive layer at a side of the flexible insulating layer far away from the flexible substrate; and a planarization layer at a side of the second conductive layer far away from the flexible substrate and having a hollow structure in the bendable region, wherein a thickness of a portion of the second insulating pattern covering the connection wire is d2, a thickness of the flexible substrate is d3, and d2≥2 μm and |d2−d3|≤3 μm.