Flexible Substrate Metal Wire Array for Ultra-Narrow Bezel AMOLED Panels
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Solution Overview
Problem
Current display panel technologies face challenges in achieving an ultra-narrow bezel design, particularly in comparison to LCD panels, where the bezel width cannot be minimized effectively due to structural limitations.
Innovation Solution
The implementation of a display panel with a flexible substrate and a metal wire array on a glass substrate, where the bending region of the flexible substrate is bent towards the side surface of the glass substrate, allowing the metal wire array to be hidden within the sides of the glass or flexible substrate, thereby reducing the packaging region width and minimizing the bezel size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the metal wire array is disposed on the flexible substrate in the conventional layout, then the connection between scanning line and row driving chip, and data line and column driving chip is achieved, but the packaging region width is increased and the bezel size is enlarged
Solution Approach 1:
The patent applies dimensionality change by moving the metal wire array from the planar display region to the bending region at the edge of the flexible substrate. This spatial relocation to a different dimension (the side/bending region) allows the wire array to be positioned outside the packaging region, thereby reducing bezel width while maintaining all necessary electrical connections between the array substrate and driving chips.
Solution Approach 2:
The patent segments the flexible substrate into distinct functional regions: a display region containing the array substrate, and a bending region containing the metal wire array. This segmentation allows the wire array to be isolated in the bending region, which can be bent toward the side surface, effectively separating the connection function from the display area and reducing the packaging region width.
2Area of stationary object
If the bending region is bent toward the side surface of the flexible substrate to hide the metal wire array, then the packaging region width is reduced, but the structural stability of the wire array connection may be compromised
Solution Approach 1:
The patent utilizes the flexibility of the flexible substrate to create a bending region that can be bent toward the side surface of the flexible substrate. This flexible structure allows the metal wire array to be repositioned to the side while maintaining electrical connections, reducing the packaging region area without compromising connection reliability through proper design of the flexible substrate and bonding structures.
3Length of moving object
If the glass substrate is stripped off the flexible substrate by laser cutting or laser stripping, then the bending region can be bent and bonded to the side surface, but the manufacturing process complexity is increased
Solution Approach 1:
The patent replaces conventional mechanical cutting or stripping methods with laser cutting or laser stripping technology to separate the glass substrate from the flexible substrate in the bending region. This substitution enables precise and clean separation, allowing the bending region to be bent and bonded to the side surface, thereby reducing bezel width while maintaining manufacturing feasibility through advanced laser processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the bezel width to the maximum extent by repositioning the metal wire array, enhancing the suitability of AMOLED display panels for ultra-narrow bezel designs.
Implementation Method 1
the bending region is bent toward a side surface of the flexible substrate deviating from the scanning line
Implementation Method 2
the part of glass substrate in the bending region on the glass substrate is stripped off the flexible substrate after being cut by laser cutting
Implementation Method 3
the glass substrate is completely stripped off the flexible substrate by laser stripping
Data Source
AI summary
The present disclosure provides a display panel. The display panel has a display region and a packaging region disposed outside the display region, and includes an array substrate including a glass substrate, a flexible substrate disposed on the glass substrate, and a scanning line and a data lines disposed on the flexible substrate, a bending region extending outside the packaging region is disposed outside the packaging region at at least one side of the flexible substrate, a metal wire array used for connecting the scanning line and the data line of the array substrate to row driving and column driving chips is disposed in the bending region on the flexible substrate, and the bending region is bent toward a side surface of the flexible substrate deviating from the scanning line.