Flexible Substrate With Slits For Low-Pressure Electronic Switches

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Solution Overview

Problem

Existing electronic components, such as switches and connectors, face challenges when integrated into flexible materials like paper or card due to the inelastic nature of these substrates, which require significant pressure to operate and are prone to tearing or permanent deformation, limiting their use in interactive printed articles.

Innovation Solution

The integration of a flexible planar substrate with strategically arranged slits allows for deformation and stretching, enabling the creation of movable electronic components like switches and connectors that require less operational pressure and maintain reliability through the use of conductive materials and a laminated structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a flexible substrate like paper or card is used for electronic components, then the components can be integrated into printed articles, but the substrate requires significant pressure to operate and is prone to tearing or permanent deformation

Engineering Contradiction:

Improveintegration into printed articlesVSAvoidresistance to tearing and permanent deformation

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The substrate is divided into multiple portions by introducing slits that extend from edges toward the center. These slits create segmented regions that can move independently, allowing the substrate to deform and stretch without tearing while maintaining structural integrity of the overall component

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent uses a thin film substrate (paper, card, or plastic) with integrated slits to create a flexible electronic component. The thin film structure combined with strategic slit placement enables the substrate to bend, stretch, and deform reversibly, maintaining reliability while being integrated into flexible printed articles

Inventive Principle:

Principle #30Flexible shells and thin films

2Ease of operation

If slits are arranged to allow portions of the substrate to move apart, then the substrate can be deformed and stretched for switches and connectors, but the structural integrity may be compromised

Engineering Contradiction:

Improvedeformation and stretching capabilityVSAvoidstructural integrity

Core Design Contradiction:

Ease of operationVSStrength

Solution Approach 1:

The substrate is segmented into multiple portions by slits that extend from edges toward the center but do not completely disconnect the substrate. This segmentation allows controlled movement and deformation of substrate portions while maintaining overall structural integrity through the continuous bridges of material between slits

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The slits are arranged in specific patterns (parallel, radial, or concentric) that enable the substrate to deform in multiple dimensions - allowing stretching in one direction while maintaining strength through the geometric arrangement of slit patterns and conductive material placement

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If the substrate is made thinner and more flexible, then it can be better integrated into printed articles, but it becomes more susceptible to damage and permanent deformation

Engineering Contradiction:

Improveflexibility for printed article integrationVSAvoidresistance to damage

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The patent employs thin film substrates (5-500 μm thick) with strategically positioned slits that enable flexibility and integration into printed articles while preventing damage through controlled deformation pathways. The thin film structure combined with slit geometry allows the substrate to bend and stretch reversibly without compromising strength

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

By segmenting the thin film substrate into portions separated by slits, the patent enables controlled local deformation while maintaining overall structural integrity. The segmentation allows stress to be distributed across multiple regions rather than concentrating in one area, preventing permanent deformation

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables the development of reliable, low-pressure-operated electronic components that can be repeatedly used without tearing or permanent deformation, expanding the use of flexible materials in interactive printed articles like games, books, and product packaging.

Implementation Method 1

a flexible planar substrate which is substantially non-stretchable, the substrate having at least two slits arranged to allow first and second portions of the substrate lying in the same plane to be moved apart

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS9349549B2Electronic component

Publication Date: 2016.05.24 NOVALIA

AI summary

An electronic component comprises a flexible planar substrate which is substantially non-stretchable, the substrate having at least two slits arranged to allow first and second portions of the substrate lying in the same plane to be moved apart, the first portion of the substrate supporting a region of conductive material.