Flexible Substrate Solder Pad Distribution for High Screen Ratio
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Solution Overview
Problem
Conventional flexible AMOLED display panels have a large non-display region due to solder pads, which reduces the screen ratio and overall display area, as they are typically gathered to form an integral trace, failing to meet current design requirements for high screen ratio devices.
Innovation Solution
A flexible substrate with multiple independent bending regions and corresponding groups of solder pads, where each group is connected to traces in the display region and the driving circuit unit, allowing for reduced non-display area by distributing solder pads across these regions rather than gathering them into an integral trace.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder pads are gathered to form an integral trace in the non-display region, then electrical connection to driving circuit is achieved, but the non-display region area increases and screen ratio decreases
Solution Approach 1:
The patent divides the solder pads into multiple independent groups (first group, second group, third group) distributed across different bending regions instead of gathering them into a single integral trace. This segmentation allows electrical connection to be maintained while reducing the concentrated area occupation in the non-display region, thereby improving screen ratio.
2Area of stationary object
If solder pads are distributed across multiple independent bending regions, then screen ratio is improved and non-display area is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent introduces multiple independent bending regions that can dynamically bend to different extents, allowing the solder pad groups to be flexibly positioned on the back side of the flexible substrate. This dynamic bending capability enables the system to achieve compact routing without requiring complex fixed structures, thus managing manufacturing complexity while improving screen ratio.
3Area of stationary object
If multiple independent bending regions are used for solder pads, then screen ratio increases, but manufacturing precision requirements increase
Solution Approach 1:
By segmenting solder pads into multiple groups located in different bending regions, each region can be manufactured and controlled independently with relatively relaxed precision requirements compared to a single large bending region. The segmentation allows for modular manufacturing where each bending region's alignment tolerance can be managed separately, reducing overall manufacturing precision challenges while maximizing display region area.
Data Source
AI summary
A flexible substrate and a display panel using the same are provided. A plurality of groups of solder pads are provided. Each group of the solder pads is connected to each bending region. That is, the plurality of the groups of solder pads are distributed on a plurality of independent bending regions. It can be avoided that all groups of solder pads mentioned in the prior art are gathered from a lower frame of the display panel to an intermediate region to form an integral trace. Therefore, an area of a non-display region is greatly reduced, and a screen ratio is improved.