Flexible Touch Pad Substrate for Reliable Thermal Bonding
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Solution Overview
Problem
Existing touch sensor devices face limitations in flexibility, cost, and long-term reliability, particularly due to the use of large and inflexible circuit boards and high-cost materials, making them unsuitable for small or irregular spaces and cost-prohibitive for various applications.
Innovation Solution
A touch sensor device utilizing a flexible circuit substrate with a high-temperature-resistant touch sensor controller affixed via thermal bonding techniques, paired with a low-temperature-resistant sensor component, providing a cost-effective and reliable solution that can be mounted on flat or curved substrates and connected using capacitive or ohmic methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If rigid circuit boards are used in touch sensor devices, then structural stability is improved, but flexibility and adaptability to limited spaces deteriorate
Solution Approach 1:
The patent replaces rigid circuit boards with flexible circuit substrates that can conform to limited and irregular spaces while maintaining electrical connectivity. The flexible substrate allows the touch sensor device to be mounted in various configurations including curved surfaces, directly resolving the contradiction between structural stability and flexibility.
2Reliability
If high-cost materials are used for substrates, then reliability is improved, but device cost increases
Solution Approach 1:
The patent applies different material properties to different components: the flexible circuit substrate uses cost-effective materials for general flexibility, while the sensor component uses specialized materials only where sensing functionality is required. This localized application of material quality maintains reliability at critical points while reducing overall device cost.
3Reliability
If high-temperature-resistant materials are used throughout the device, then thermal bonding reliability is improved, but device cost increases
Solution Approach 1:
The patent uses high-temperature-resistant materials specifically for the flexible circuit substrate and bonding interfaces where thermal processing occurs, while the sensor component uses cost-effective materials that do not require high-temperature resistance. This localized application of heat-resistant materials ensures thermal bonding reliability only where needed, reducing overall device cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible touch sensor device offers improved flexibility, reliability, and reduced costs, enabling its use in diverse applications while maintaining high temperature resistance and dimensional stability.
Implementation Method 1
the flexible circuit substrate of the touch sensor includes a material that provides relatively high temperature resistance
Implementation Method 2
in some capacitive touch sensors capacitive coupling can be used to provide connection between the flexible circuit substrate and the sensor component
Data Source
AI summary
A touch sensor device is provided that uses a flexible circuit substrate to provide an improved input device. Specifically, the present invention uses a touch sensor controller affixed to the flexible circuit substrate, which is coupled to a sensor component to provide a flexible, reliable and cost effective touch sensor suitable for a wide variety of applications. In one embodiment the touch sensor uses a flexible circuit substrate that provides relatively high temperature resistance. This allows the touch sensor controller to be affixed using reliable techniques, such as various types of soldering. The sensor component can comprise a relatively low-temperature-resistant substrate that can provide a cost effective solution. Taken together, this embodiment of the touch sensor provides reliability and flexibility at relatively low cost.