Flexible Wiring Substrate with Opening for Display Device

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Solution Overview

Problem

Flexible printed wiring substrates face challenges in bending and connecting to display panels due to increased thickness and repulsive force, which hinders frame narrowing and high-definition terminal pitch requirements, while existing bifurcated configurations complicate dimensional accuracy and yield.

Innovation Solution

A flexible wiring substrate with a first region having a smaller cross-sectional area due to an opening or notch, allowing for reduced repulsive force and improved bendability, and a second region maintaining rigidity with connection terminals, facilitating thermocompression bonding and high-density pixel support.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the wiring substrate uses a heat-resistant and mechanically strength strong resinous material such as polyimide, then the mechanical strength and heat resistance are improved, but the flexibility and bendability deteriorate

Engineering Contradiction:

Improvemechanical strengthVSAvoidflexibility

Core Design Contradiction:

StrengthVSEase of operation

Solution Approach 1:

The wiring substrate is divided into a first region with a smaller cross-sectional area (for bending) and a second region with a larger cross-sectional area (for maintaining strength and rigidity). This segmentation allows each region to have optimized properties for its specific function, resolving the contradiction between flexibility and strength.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the wiring substrate are given different cross-sectional areas tailored to their specific requirements. The first region has reduced cross-sectional area to enhance flexibility and bendability, while the second region maintains larger cross-sectional area to provide mechanical strength and rigidity for connection terminals.

Inventive Principle:

Principle #3Local quality

2Strength

If the wiring substrate has increased thickness, then the mechanical strength is improved, but the repulsive force increases making bending more difficult

Engineering Contradiction:

Improvemechanical strengthVSAvoidrepulsive force

Core Design Contradiction:

StrengthVSForce

Solution Approach 1:

The wiring substrate is segmented into regions with different thicknesses. The first region has reduced thickness to minimize repulsive force and enable easy bending, while the second region maintains increased thickness to provide mechanical strength for connection terminals.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The thickness of the wiring substrate is locally optimized: the first region has smaller cross-sectional area (reduced thickness) to reduce repulsive force and improve bendability, while the second region has larger cross-sectional area (increased thickness) to maintain mechanical strength.

Inventive Principle:

Principle #3Local quality

3Adaptability or versatility

If a bifurcated configuration is used for connection parts, then the adaptability is improved, but the dimensional accuracy and manufacturing yield complicate

Engineering Contradiction:

Improveconnection configurationVSAvoiddimensional accuracy

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The wiring substrate is segmented into distinct first and second regions with clearly defined boundaries. The first region handles bending and connection adaptability, while the second region maintains dimensional accuracy for terminals, separating these functions to avoid manufacturing complications.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables easier bending and connection to display panels, improving bonding accuracy and reliability while reducing the frame size and increasing the reliability of electrical connections, even at high-definition terminal pitches.

Implementation Method 1

The wiring substrate includes a first region bent in a direction crossing the one side... The first region is provided with an opening through the base film and the cover film... the cross-sectional area of the first region in the direction parallel to the one side is smaller than the cross-sectional area of the second region

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

thermocompression bonding and high-density pixel support... bonding accuracy and reliability

Methodology Applied

Scientific EffectThermocompression bonding:

Data Source

PatentUS20240419224A1Display device and display device for electronic device including sensor component

Publication Date: 2024.12.19 MAGNOLIA WHITE CORP

AI summary

An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.