Flip Chip Laser Bonding Beam Intensity Equalization
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Solution Overview
Problem
Conventional flip chip bonding methods, such as thermal compression and laser compression, face challenges with non-uniform energy distribution from laser beams, leading to reduced productivity, potential chip damage, and bonding quality issues due to uneven heating.
Innovation Solution
A flip chip bonder apparatus with a beam intensity adjuster, such as a glass rod, is used to equalize the laser beam intensity along the emission path, ensuring uniform heating of the semiconductor chip by adjusting the beam's width and length using focus lenses and optical units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a laser beam is used to heat the semiconductor chip in laser compression bonding, then productivity is improved and thermal expansion is reduced, but the laser beam intensity is non-uniform causing uneven heating and potential chip damage
Solution Approach 1:
A beam intensity adjuster is introduced as an intermediary component between the laser beam source and the semiconductor chip. This adjuster modifies the laser beam's intensity distribution to achieve uniform heating across the chip surface while maintaining the high-speed heating capability of laser compression bonding
Solution Approach 2:
The patent changes the intensity parameter of the laser beam by introducing a beam intensity adjuster. This adjuster modifies the spatial distribution of laser intensity from non-uniform to uniform, enabling even heating across the semiconductor chip while preserving the rapid heating advantage
2Power
If the laser beam intensity is increased to improve heating efficiency, then bonding speed increases, but the non-uniform intensity distribution causes localized overheating and chip damage
Solution Approach 1:
The beam intensity adjuster serves as a protective intermediary that redistributes laser beam intensity uniformly across the chip surface. This prevents localized concentration of energy that would cause overheating and damage, while still allowing high overall power delivery for efficient heating
Solution Approach 2:
By modifying the intensity distribution parameter of the laser beam through the beam intensity adjuster, the system achieves uniform energy distribution across the chip. This allows high power input for fast heating without creating harmful hot spots that would damage the semiconductor chip
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform energy distribution across the semiconductor chip, preventing damage and improving bonding quality by ensuring consistent heating, thus enhancing the flip chip bonding process.
Implementation Method 1
a laser generator for emitting a laser beam to a semiconductor chip to heat the semiconductor chip
Implementation Method 2
a beam intensity adjuster disposed on a laser emission path between the semiconductor chip and the laser generator to equalize the intensity of the laser beam
Implementation Method 3
adjusting the beam's width and length using focus lenses and optical units
Data Source
AI summary
An apparatus for heating a chip includes: a laser generator for emitting a laser beam to a semiconductor chip to heat the semiconductor chip; and a beam intensity adjuster disposed on a laser emission path between the semiconductor chip and the laser generator to equalize the intensity of the laser beam to be emitted to the semiconductor chip. A flip chip bonder having the chip heating apparatus, and a method for bonding a flip chip using the same are also provided.