Flip Chip Integration in Layered Chip Card Foil Substrates
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Solution Overview
Problem
The production of chip cards is cost-intensive due to separate processes for chip modules and card bodies, with elaborate wire bonding and molding often required.
Innovation Solution
A method where a foil substrate with contact layouts and flip chips is bonded with a reinforcement layer to form a layered compound, eliminating the need for punching out chip modules and allowing for cost-effective production of chip cards with integrated flip chips, optionally using an intermediate foil for protection and omitting adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If chip modules are inserted in prefabricated chip card bodies using separate production processes, then the production process is modular and flexible, but the production cost increases and production time is extended
Solution Approach 1:
The patent merges the chip module production and card body production into a single integrated process. The foil substrate with contact layouts and flip chips is bonded directly with the reinforcement layer to form a layered compound, eliminating the need for separate chip module insertion steps and reducing overall production cost and complexity
Solution Approach 2:
The contact layouts and flip chips are prepared on the foil substrate in advance before bonding with the reinforcement layer. This preliminary preparation allows the chip modules to be ready for direct integration into the final card structure, reducing subsequent assembly steps
2Ease of manufacture
If elaborate wire bonding and molding processes are used for chip modules, then reliable electrical connections are achieved, but production cost and production time increase
Solution Approach 1:
The patent extracts and eliminates the elaborate wire bonding and molding processes from the traditional chip module production. By using flip chip technology where chips are mounted directly on contact areas, the complex wire bonding step is removed entirely, reducing production cost and time while maintaining reliable electrical connections through direct contact
Solution Approach 2:
The patent adopts a simpler, more cost-effective approach by using direct flip chip mounting instead of expensive wire bonding and molding processes. The foil substrate with integrated contact layouts provides sufficient reliability without requiring elaborate protective molding
3Productivity
If chip modules are punched out from carrier band, then individual chip cards are formed, but part of the carrier band is wasted and production efficiency decreases
Solution Approach 1:
The patent combines the chip module and card body into a single integrated foil substrate structure. The complete foil substrate with contact layouts and flip chips becomes part of the layered compound, eliminating the need to punch out individual chip modules from a carrier band and thereby eliminating material waste and improving production efficiency
Solution Approach 2:
The contact layouts and flip chips are prepared on the foil substrate in advance in the correct positions and configurations. This preliminary preparation eliminates the need for subsequent punching and insertion operations, directly improving production efficiency and eliminating waste
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs by integrating the foil substrate with flip chips into a layered compound, simplifying the manufacturing process and enabling cost-effective production of chip cards with reduced mechanical stress on flip chips.
Implementation Method 1
bond the foil substrate, which on the front side is equipped with several contact layouts for the contact-type communication and on the back side with several contact layouts and flip chips mounted or to be mounted thereon, together with at least one reinforcement layer, to form a layered compound
Data Source
AI summary
A chip card in the form of an ID-1 card, a plug-in SIM or a USB token has a layered compound (12) with two (4, 5) or three (4, 5, 9) layers extending over the complete chip card (1). An exterior foil layer (4) has on its outward facing front side (4a) a communication contact layout (2) and on its back side (4b) a flip chip (7), as well as a flip chip contact layout (6) which is electroconductively connected with the communication contact layout (2) on the front side.