Flip-Chip LED With Sloping Reflective Frame
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Solution Overview
Problem
Existing LED devices in chip size packaging struggle with light emission efficiency and confined light distribution, especially when used in applications requiring bright illumination of a limited area, due to the inability to manage variations in light emission characteristics and the complexity of manufacturing processes.
Innovation Solution
An LED device with a reflective frame around the periphery, featuring a sloping inner wall that redirects lateral light emission upward, integrated with a phosphor member for wavelength conversion, allowing for compact size and improved light emission efficiency while confining light distribution within a narrow range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a reflective frame with sloping inner wall is added to redirect lateral light emission upward, then light emission efficiency is improved and light distribution is confined, but device complexity increases
Solution Approach 1:
The reflective frame is integrated with the phosphor member to form a single composite structure, eliminating the need for separate reflective frame and phosphor member components. This merging reduces assembly steps and structural complexity while maintaining the light redirecting function that improves emission efficiency.
Solution Approach 2:
The reflective frame serves multiple functions: it redirects lateral light emission upward to improve efficiency, confines light distribution within a narrow range, and provides structural support for the phosphor member. This multi-functionality reduces the need for additional components, thereby managing device complexity.
2Area of stationary object
If the LED device is designed in chip size packaging format, then mounting area is reduced and design freedom is increased, but light distribution control becomes difficult
Solution Approach 1:
The reflective frame is designed with a sloping inner wall that has varying angles and positions tailored to specific locations, allowing precise control of light distribution in different directions. This localized optimization enables effective light management in the compact CSP format without requiring larger mounting area.
3Manufacturing precision
If variations in light emission characteristics among LED dies are addressed by individual management, then color emission control is improved, but manufacturing complexity and time increase
Solution Approach 1:
The phosphor member is designed with adjustable composition and properties that can be modified to compensate for variations in light emission characteristics among different LED dies. By changing the phosphor parameters (such as material composition, particle size, or concentration), consistent color emission can be achieved across批量 production without individual management of each LED die.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances light emission efficiency and confines light distribution, making the LED device suitable for applications requiring focused illumination while being easy to manufacture and manage in terms of color emission characteristics.
Implementation Method 1
a phosphor member (11), disposed at least on an upper side of the LED die (16), for wavelength-converting light emitted from the LED die (16)
Implementation Method 2
an inner wall of the reflective frame (12) is provided with a sloping face which is in contact with a side face of the phosphor member (11), and the sloping face is formed so that an inside diameter of the reflective frame (12) becomes larger from a lower side of the LED die (16) toward the upper side thereof
Data Source
AI summary
Provided is an LED device which is compact while having good luminous efficiency and a focused light distribution. This LED device is provided with: a reflective frame around the outer periphery of the LED device; an LED die which has a transparent insulating substrate, a semiconductor layer formed on the bottom surface of the transparent insulating substrate, and an outer connection electrode disposed on the semiconductor layer; and a fluorescent member which is disposed on at least the top surface of the LED die and which converts the wavelength of the light emitted from the LED die. On the inside of the reflective frame is an inclined surface in contact with the lateral surface of the fluorescent member, and the inclined surface is formed such that the inner diameter of the reflective frame widens from the bottom surface towards the top surface of the LED die. Also provided is a manufacturing method of the LED device.