Solid-State Devices TRIZ Cases

A photochromic layer in an OLED panel forms a resonant cavity with the semitransparent cathode to extend the micro cavity total optical distance.

A trench diode structure forms within an epi layer using shared gate polysilicon steps.

Asymmetric conjugated polymers improve energy conversion efficiency by optimizing molecular structure to boost charge separation and current density.

Different coupling capacitor values compensate for varied emission efficiencies, reducing greenish hue defects in low-luminance images.

Precision edge trimming stops within 30 microns of the bonding interface, preventing delamination in low-temperature bonded multilayer structures.

A non-volatile memory circuit partitions arrays into sub-arrays with distinct cell characteristics tailored for specific use models.

A discrete 3D vertical memory design separates the array and peripheral circuit dies to optimize back-end-of-line structures independently.

A buffer layer in an organic electroluminescent element reduces optical differences between adjacent regions to create a uniform surface.

A semiconductor storage device uses a composite bit line structure to lower electrical resistance in vertical transistors.

Lower partitions between color filter segments prevent oblique light mixing, increasing luminous sensitivity for white pixels.

A touch-controlled panel manufacturing method merges organic film and bridging connection layer formation into a single masking step.

Dummy gate masking protects the central FinFET channel during epitaxial growth and annealing, reducing dopant loss and mobility degradation.

An auxiliary spreading layer matches organic wettability to improve ink deposition on inorganic barriers.

Variable density crack prevention lines mitigate stress-induced fractures in the bending zone, preserving wiring integrity and device reliability.

A white wall surrounding the LED packaging layer reflects lateral light to ensure consistent color temperature.

Sloping reflective frame redirects lateral light upward to improve emission efficiency and confine distribution within narrow ranges.

Segmented adhesive design resolves the trade-off between moisture blocking and mechanical strength, preventing edge peeling in OLED substrates.

A multi-layered sealing structure with inorganic and organic insulating layers protects organic light emitting elements.

A matrix photodetector captures code strip images to determine precise joining points for scanner data.

A multi-stack OLED structure uses asymmetric charge generation layers to balance electron and hole flow between electrodes.

A semiconductor laser integrates a monitor photodiode sharing a quantum layer with the light emitting part to enable precise optical detection.

A light blocking layer between the array substrate and pixel define layer protects thin film transistors from ambient optical excitation.

Asymmetric source line layout minimizes parasitic capacitance, enhancing operation speed without increasing unit cell area.

A display device arranges power, sensing, and data lines on different layers to prevent electrode short circuits.

A planarization layer on an OLED back plate flattens the second source electrode surface during manufacture.

Fluorescent material surface modification via fluorine-containing compound deposition in an inert gas atmosphere.

A resistive memory circuit uses complementary states to control current flow through drive and read transistors.

A non-volatile memory cell capacitor structure surrounds the active region to electrically connect floating and control gate electrodes.

Recessed transparent substrate structures concentrate light onto photo diodes, preventing particle contamination during manufacturing.

A display substrate uses doped polycrystalline silicon for pixel electrodes and storage capacitors to enhance aperture ratio.

Selective deposition creates nickel oxide memory cells, eliminating complex etching steps that increase fabrication costs and device complexity.

Orienting light emitting elements at 45-degree intervals prevents visual recognition of unevenness in luminance across the light-emitting surface.

Resin fills displaced holes across stacked layers to cure and align outer edges, resolving positioning errors.

A reflective pixel electrode covers bumps to form an uneven surface that enhances light reflection in transflective displays.

Stacking hexagonal MTJ arrays across multiple layers increases memory density without reducing the planar pitch between elements.

Sol-gel processing creates a ferroelectric thin film with controlled crystal orientation, suppressing anomalous grain growth and contamination from seed layers.

Tailored diketopyrrolopyrrole polymers resolve the trade-off between solution processability and charge transport, delivering enhanced stability.

A substrate processing method forms a protective barrier on densified insulating layers to control isotropic etching rates during VNAND fabrication.

A phosphorescent OLED emission layer uses host and dopant energy level alignment to confine triplet excitons within the active region.

Sequentially covering pixels with a shield controls solvent evaporation rates, resolving thickness non-uniformity across the substrate.

Silicon filling material reinforces thin organic light emitting display substrates, preventing moisture infiltration and mechanical failure under stress.

Oxidizing metal lines expands their height to isolate the control gate from global bit lines, resolving manufacturing complexity while ensuring precise overlap.

Integrating a reflecting cup with structural support resolves the trade-off between light extraction efficiency and device complexity.

A polarizing plate uses a specific UV absorber and adhesive modulus to protect light emitting diodes.

A two-dimensional semiconductor detector array uses a graded buffer layer to suppress dark current in near-infrared imaging.

Merges sensor and packaging to reduce volume and complexity, enabling direct PCB mounting without underfill.

A photochromic thin film changes translucency based on light wavelength to enable fingerprint sensing within the display area.

Anisotropic etching creates convex microstructures that extract internal light while preserving color stability.

A thin film encapsulation unit with a corrugated surface refracts light at various angles to enhance lateral visibility in organic light-emitting displays.