OLED Substrate Dual Adhesive Layer for Moisture Isolation
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Solution Overview
Problem
Existing organic light emitting diode substrates packaged with entire-surface adhesives fail to effectively isolate the organic light emitting diode from moisture and oxygen due to inadequate moisture and oxygen blocking capabilities of pressure sensitive adhesives and poor adhesive strength of thermos-curing adhesives, leading to potential damage and peeling issues.
Innovation Solution
An organic light emitting diode substrate design featuring a base substrate with a device layer surrounded by an inner and outer ring region, where a thermos-curing adhesive layer blocks moisture and oxygen, and a pressure sensitive adhesive frame with higher adhesive strength is applied on the outer ring region to enhance protection, eliminating seams and ensuring secure adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a pressure sensitive adhesive is used for entire-surface adhesion, then adhesive strength is improved, but moisture and oxygen blocking capability deteriorates
Solution Approach 1:
The adhesive structure is segmented into two distinct parts: a first adhesive layer for moisture and oxygen blocking, and a second adhesive frame for providing adhesive strength. This segmentation allows each component to specialize in its respective function without compromise.
Solution Approach 2:
Different regions of the adhesive structure have different functional qualities: the first adhesive layer (covering the device layer) provides moisture and oxygen blocking, while the second adhesive frame (at the edges) provides strong adhesion. Each region is optimized for its specific local requirement.
2Object-affected harmful factors
If a thermos-curing adhesive is used for entire-surface adhesion, then moisture and oxygen blocking capability is improved, but adhesive strength deteriorates
Solution Approach 1:
The adhesive structure is segmented into two distinct parts: a first adhesive layer for moisture and oxygen blocking, and a second adhesive frame for providing adhesive strength. This segmentation allows each component to specialize in its respective function without compromise.
Solution Approach 2:
Different regions of the adhesive structure have different functional qualities: the first adhesive layer (covering the device layer) provides moisture and oxygen blocking, while the second adhesive frame (at the edges) provides strong adhesion. Each region is optimized for its specific local requirement.
3Area of stationary object
If entire-surface adhesion is used, then adhesion coverage is improved, but edge peeling resistance deteriorates
Solution Approach 1:
The adhesive structure is segmented into two distinct parts: a first adhesive layer for moisture and oxygen blocking, and a second adhesive frame for providing adhesive strength. This segmentation allows each component to specialize in its respective function without compromise.
Solution Approach 2:
Different regions of the adhesive structure have different functional qualities: the first adhesive layer (covering the device layer) provides moisture and oxygen blocking, while the second adhesive frame (at the edges) provides strong adhesion. Each region is optimized for its specific local requirement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively isolates the device layer from moisture and oxygen while providing strong adhesive strength, preventing damage and peeling, thus extending the lifespan of the organic light emitting diode substrate.
Implementation Method 1
a first adhesive layer adhered on the device layer and the inner ring region and covering the device layer and the inner ring region, the first adhesive layer being used to block moisture and oxygen for the device layer
Implementation Method 2
a second adhesive frame adhered on the outer ring region and the first adhesive layer and covering a portion of the first adhesive layer over the inner ring region, the second adhesive frame having a higher adhesive strength than the first adhesive layer
Data Source
AI summary
The present disclosure discloses an organic light emitting diode substrate, comprising: a base substrate and a device layer formed in a middle part thereon, a region on the base substrate other than the device layer being divided into an inner ring region that surrounds the device layer and an outer ring region outside the inner ring region; a first adhesive layer adhered on the device layer and the inner ring region and covering the device layer and the inner ring region, the first adhesive layer being used to block moisture and oxygen for the device layer; a second adhesive frame adhered on the outer ring region and the first adhesive layer and covering a portion of the first adhesive layer over the inner ring region, the second adhesive frame having a higher adhesive strength than the first adhesive layer.

