Wafer Level Package Magnetic Sensor Integration
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Solution Overview
Problem
Existing semiconductor components with magnetic field sensors face challenges in miniaturization, cost-effectiveness, and integration complexity due to the need for additional processing steps and housing materials, which hinder their efficient use in compact applications like smartphones and door sensors.
Innovation Solution
The integration of magnetic field sensors into semiconductor chips as Wafer Level Packages (WLPs) with external contact elements and optional magnets, allowing direct mounting on printed circuit boards without underfill and using flip-chip technology for compact, cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If magnetic field sensors are integrated into semiconductor chips using traditional packaging methods, then the sensors can function properly, but the components become larger and more complex due to additional housing materials and processing steps
Solution Approach 1:
The patent merges the magnetic field sensor, packaging structure, and mounting interface into a single integrated semiconductor chip component. The sensor is directly embedded in the chip substrate with contact elements formed on the same substrate, eliminating the need for separate housing and mounting structures, thereby reducing both volume and integration complexity.
Solution Approach 2:
The semiconductor chip serves multiple functions simultaneously: it acts as the sensor element, the packaging housing, and the mounting interface for the printed circuit board. The contact elements on the chip surface provide both electrical connection and mechanical mounting functions, reducing the need for additional components and simplifying the overall integration process.
2Reliability
If additional processing steps and housing materials are used for magnetic field sensor integration, then the sensors can be protected and connected, but production costs increase
Solution Approach 1:
The packaging structure and sensor element are combined into a single semiconductor chip manufacturing process. The contact elements are formed directly on the chip substrate using standard semiconductor fabrication techniques, eliminating the need for separate housing materials and additional assembly steps, thereby reducing production costs while maintaining protection and connectivity.
3Ease of operation
If traditional packaging methods are used for semiconductor chips with magnetic field sensors, then the chips can be mounted on printed circuit boards, but underfill and additional mounting steps are required
Solution Approach 1:
The mounting interface is integrated directly into the semiconductor chip structure. Contact elements are formed on the chip surface that can be directly soldered to the printed circuit board, eliminating the need for separate underfill materials and additional mounting steps, thereby simplifying the mounting process and improving production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in smaller, lighter, and more cost-effective semiconductor components with enhanced sensitivity and reduced production costs, enabling efficient integration into space-constrained devices like smartphones and door sensors.
Implementation Method 1
By way of example, the magnetic field sensors may be Hall elements or GMR sensors, which utilize the Hall effect or the GMR (Giant MagnetoResistance) effect, respectively, for measuring a magnetic field
Implementation Method 2
By way of example, the magnetic field sensors may be Hall elements or GMR sensors, which utilize the Hall effect or the GMR (Giant MagnetoResistance) effect, respectively, for measuring a magnetic field
Data Source
AI summary
The invention relates to a semiconductor component (100) comprising a semiconductor chip (10) configured as a wafer level package, a magnetic field sensor (11) being integrated into said semiconductor chip.