LED Package Reflecting Cup Light Extraction

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Solution Overview

Problem

Conventional LED packages face challenges in enhancing light extraction efficiency and thermal management due to the lack of effective integration of a reflecting cup structure, which affects the overall performance and reliability of illumination devices.

Innovation Solution

The proposed LED package incorporates a reflecting cup extending from the base, surrounding the LED die and electrodes, with a supporting portion inside the cup to enhance structural strength and light reflection, while the encapsulation covers the LED die and electrodes, potentially including phosphor powders for enhanced light diffusion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a reflecting cup structure is integrated into the LED package, then light extraction efficiency is improved, but device complexity increases

Engineering Contradiction:
Improvelight extraction efficiencyVSAvoidstructure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The reflecting cup is integrated directly into the LED package structure, merging the light reflection function with the package housing. This eliminates the need for separate external reflectors and reduces overall device complexity while improving light extraction efficiency.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The reflecting cup structure serves multiple functions: it reflects light to improve extraction efficiency, provides structural support for the LED die, and aids in thermal management. This multi-functionality reduces the need for additional components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Temperature

If a reflecting cup structure is integrated into the LED package, then thermal management is improved, but device complexity increases

Engineering Contradiction:
Improvethermal managementVSAvoidstructure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The reflecting cup is combined with the thermal management structure, allowing it to serve both optical reflection and heat dissipation functions. This integration improves thermal management without requiring separate thermal management components.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The reflecting cup structure performs multiple functions including light reflection, structural support, and thermal management. This multi-functionality approach improves thermal management while avoiding additional components that would increase complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Strength

If a supporting portion is added inside the reflecting cup, then structural strength is improved, but device complexity increases

Engineering Contradiction:
Improvestructural strengthVSAvoidstructure complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The supporting portion is strategically placed inside the reflecting cup at the specific location where the LED die is mounted. This localized reinforcement provides necessary structural strength without adding complexity to the entire device structure.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The supporting portion is integrated into the reflecting cup structure, combining the support function with the existing optical component. This eliminates the need for separate support structures and minimizes overall device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves light extraction efficiency and thermal management, leading to better performance and reliability of the LED package by effectively directing and reflecting light, as well as providing structural support to the reflecting cup.

Implementation Method 1

a reflecting cup extending from the base, surrounding the LED die and electrodes

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 2

the encapsulation covers the LED die and electrodes, potentially including phosphor powders for enhanced light diffusion

Methodology Applied
Scientific EffectLight diffusion: Scattering

Data Source

PatentUS9640742B2LED package with reflecting cup
Publication Date: 2017.05.02 ADVANCED OPTOELECTRONIC TECH INC
  • US9640742B2 patent drawing
  • US9640742B2 patent drawing
  • US9640742B2 patent drawing

AI summary

The present disclosure provides an LED package which includes electrodes, an LED die electrically connected with the electrodes, an encapsulation covering the LED die; and a casing surrounding the encapsulation and the LED die. The casing includes a base, a reflecting cup and a supporting portion. The reflecting cup extends from the base upwards, the reflecting cup surrounds the LED die, and the supporting portion is located inside the reflecting cup and across the electrodes.