OLED Back Plate Planarization Layer Etching Mask
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing OLED back plates have a second source electrode with poor surface flatness, leading to a smaller OLED light emitting area and lower aperture ratio due to the direct formation of the second source on the interlayer dielectric layer with poor surface flatness.
Innovation Solution
A manufacture method for an OLED back plate involving the formation of a planarization layer on the interlayer dielectric layer, which serves as a mask for the etching process, thereby flattening the surface of the second source electrode and increasing the OLED light emitting area and aperture ratio.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the second source electrode is directly formed on the interlayer dielectric layer, then the manufacturing process is simple, but the surface flatness is poor resulting in smaller OLED light emitting area and lower aperture ratio
Solution Approach 1:
A planarization layer is formed on the interlayer dielectric layer before forming the second source electrode. This preliminary action creates a flat surface for the electrode, enabling a larger OLED light emitting area while maintaining manufacturing simplicity through sequential layer deposition.
Solution Approach 2:
The planarization layer serves as an intermediary between the interlayer dielectric layer and the second source electrode. It mediates the surface flatness issue, providing a smooth foundation for the electrode while allowing the underlying irregular structure to remain.
2Productivity
If the second source electrode is directly formed on the interlayer dielectric layer, then the manufacturing steps are reduced, but the aperture ratio decreases due to limited flat surface area
Solution Approach 1:
The planarization layer is deposited as a preliminary step before electrode formation, enabling larger aperture ratio without significantly increasing overall manufacturing complexity. The additional step is offset by the elimination of subsequent surface correction processes.
Solution Approach 2:
The introduction of the planarization layer changes the surface topology parameter of the substrate, transforming it from irregular to flat. This parameter change enables the OLED light emitting area to expand to the maximum possible aperture ratio.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a larger OLED light emitting area and higher aperture ratio by ensuring the surface of the second source electrode is flattened, enhancing the display's efficiency and performance.
Implementation Method 1
which serves as a mask for the etching process, thereby flattening the surface of the second source electrode
Data Source
AI summary
The present invention provides an OLED back plate and a manufacture method thereof. In the manufacture method of the OLED back plate of the present invention, by forming the planarization layer on the interlayer dielectric layer, and the planarization layer can serve as the mask of the etching process of the interlayer dielectric layer, and also can make the surface of the second source made on the surface thereof be flattened, which is advantageous to increase the area of the OLED light emitting area and to increase the aperture ratio. In the OLED back plate of the present invention, by forming the planarization layer on the interlayer dielectric layer, the surface of the second source made on the surface of the planarization layer is flattened, of which the OLED light emitting area is larger and the aperture ratio is higher.