LED Package White Wall Lateral Light Reflection
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Solution Overview
Problem
Conventional light emitting diode packaging structures experience color temperature deviations between normal and lateral light emissions due to the positioning of fluorescent films, leading to uneven light emission and the blue-yellow ring defect, which is difficult to correct without complex optical redesign.
Innovation Solution
Incorporating a white wall surrounding the peripheral side of the packaging layer in the light emitting diode package to reflect lateral light and prevent color temperature deviations, using materials like glass, quartz, or light reflection films, which can be adjusted with filling particles for optimal reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If fluorescent film is disposed on the blue light chip, then light transferring at different wavelength is achieved, but colour temperature deviation between normal and lateral light occurs
Solution Approach 1:
A white wall is introduced as an intermediary component between the light emitting diode and the surrounding environment. The white wall reflects lateral light back toward the light outlet face, mediating the light distribution to reduce colour temperature deviation between normal and lateral light without requiring changes to the fluorescent film or light chip configuration.
Solution Approach 2:
The white wall is positioned specifically at the peripheral side of the light transferring layer where lateral light emerges. This localized intervention targets the specific region where colour temperature deviation occurs, reflecting only the lateral light that causes the blue-yellow ring defect while leaving the normal light path unchanged.
2Manufacturing precision
If secondary optics design is used to correct the blue-yellow ring, then light emission uniformity is improved, but device complexity increases
Solution Approach 1:
The white wall is a simple, inexpensive structural component that can be easily manufactured and integrated into the light emitting diode package. It replaces complex secondary optics with a straightforward reflective surface, significantly reducing device complexity while achieving the same light emission uniformity correction.
Solution Approach 2:
Instead of using complex optical elements to redirect light, the invention uses a simple reflective surface to bounce lateral light back toward the center. This inverted approach—using reflection rather than refraction or complex optical paths—achieves light uniformity with minimal complexity.
3Manufacturing precision
If white wall is added to surround the peripheral side, then colour temperature deviation is reduced, but device complexity increases
Solution Approach 1:
The white wall can be implemented as a thin film or coating applied to the peripheral side of the light transferring layer or packaging layer. This flexible implementation minimizes the added structural complexity while effectively reflecting lateral light and reducing colour temperature deviation.
Solution Approach 2:
The white wall is integrated with the existing packaging layer or light transferring layer structure, merging the reflective function with the existing packaging components. This consolidation avoids adding separate complex structures while achieving the desired light reflection and colour temperature uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The white wall effectively reduces color temperature deviations and light unevenness by reflecting lateral light, ensuring consistent color temperature and minimizing the blue-yellow ring effect without requiring complex secondary optics design adjustments for various light emitting diode configurations.
Implementation Method 1
the lateral light that is parallel to the light transferring layer can be reflected by the white wall
Data Source
AI summary
A light emitting diode (LED) package includes a light element, a light transferring layer disposed on the light element, a packaging layer enclosing the light transferring layer, a white wall surrounding the packaging layer and a diffusion film disposed on the packaging layer. The light transferring layer has a light outlet face, a light inlet face opposite to the light outlet face and a peripheral side. The light inlet face faces the light element. The white wall surrounds the peripheral side that is enclosed by the packaging layer.