Flip Chip LED Testing Apparatus Using Vacuum Adhesion
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Solution Overview
Problem
Existing testing apparatuses for LEDs are inadequate for measuring flip chip LEDs due to measurement errors caused by vent holes, which lead to inaccurate results and resource inefficiency.
Innovation Solution
A testing apparatus comprising a transparent substrate, a spacing member, a flexible transparent carrier, and a vacuum generator that forms a sealed space for maintaining the carrier in contact with the substrate, allowing for accurate measurement of flip chip LEDs without vent holes, using negative pressure to cling the carrier to the substrate and prevent deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If vent holes are added to the supporting member to maintain the carrier fixed, then the carrier stability is improved, but the measurement precision deteriorates due to deformation near vent holes
Solution Approach 1:
The invention removes the harmful vent holes from the supporting member structure. Instead of extracting gas through holes that cause deformation, the system uses a vacuum chamber to evacuate air from the entire testing space, eliminating the source of localized deformation while maintaining carrier stability through vacuum adhesion.
Solution Approach 2:
The invention introduces a vacuum chamber as an intermediary between the supporting member and the carrier. This vacuum chamber mediates the fixation process by creating a vacuum environment that adheres the carrier to the supporting member without requiring vent holes, thus preventing deformation while maintaining stability.
2Stability of the object's composition
If adhesive tape or adhesive is used to fix the LED on the carrier, then the LED positioning stability is improved, but the light transmission is worsened due to obstruction
Solution Approach 1:
The invention removes adhesive materials from the light transmission path. Instead of using adhesive tape or glue that obstruct light, the system relies on vacuum adhesion to fix the LED wafer to the carrier, eliminating the obstruction while maintaining positioning stability.
Solution Approach 2:
The invention replaces the mechanical adhesion system (adhesive tape/glue) with a vacuum-based adhesion system. This substitution eliminates the need for light-obstructing adhesives while maintaining the LED's stable positioning on the carrier during testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise measurement of flip chip LEDs by preventing deformation and obstruction, reducing measurement errors and resource consumption, and improving the efficiency of testing.
Implementation Method 1
when the extraction apparatus 14 pumps air out of the closed space, it will generate negative pressure through those vent holes 120
Implementation Method 2
The vacuum generator is connected to the closed space for pumping air out of the closed space
Implementation Method 3
the optical detector further converts an optical signal into an electrical signal
Data Source
AI summary
A testing apparatus for flip chip LEDs includes a transparent substrate, a spacing member, a flexible transparent carrier, and a vacuum generator. The spacing member is configured on a first surface of the transparent substrate. The flexible transparent carrier is removably assembled to the spacing member so that a closed space is formed by the flexible transparent carrier, the spacing member, and the first surface of the transparent substrate. The vacuum generator is connected to the closed space for pumping air out of the closed space, and then a part of the transparent substrate clings to the first surface to form a testing area for loading the flip chip LED.