Flip-Chip Light Module with Detachable Lens Detection
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Solution Overview
Problem
Existing light-emitting modules lack effective detection mechanisms to determine if an optical element is detached, which can lead to damage and inefficiencies in lighting systems.
Innovation Solution
A flip-chip light-emitting module design that includes a package assembly with a frame surrounding a heat dissipation substrate, a lens unit, and conductive paths, where a light-transmitting conductive layer is connected to the conductive paths to detect detachment and trigger protection measures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional light-emitting modules are used without detection mechanisms, then the structure is simple and cost-effective, but the system cannot detect optical element detachment leading to potential damage and reduced reliability
Solution Approach 1:
The patent combines the optical function and detection function into a single integrated structure. The light-transmitting conductive layer is incorporated directly into the lens unit, merging the optical element and the detection element into one component. This allows the system to detect optical element detachment while maintaining relatively simple overall structure.
Solution Approach 2:
The lens unit is designed to serve multiple functions: it acts as both the optical element for light transmission and the detection element for detecting detachment status. The light-transmitting conductive layer within the lens unit provides both optical functionality and electrical connection for detection purposes,实现一物多用.
2Reliability
If a detection mechanism with light-transmitting conductive layer is implemented, then optical element detachment can be detected and system reliability improved, but the manufacturing process becomes more complex
Solution Approach 1:
By merging the optical element and detection element into the same lens unit structure, the patent reduces the total number of components that need to be manufactured and assembled. The light-transmitting conductive layer is integrated into the lens manufacturing process rather than being a separate component, simplifying the overall manufacturing workflow.
Solution Approach 2:
The detection functionality is built into the lens unit during the manufacturing process itself. The light-transmitting conductive layer is prepared and positioned within the lens unit before final assembly, allowing detection capability to be established early in the manufacturing process rather than requiring additional post-assembly steps.
3Measurement precision
If conductive paths are separated and electrically connected to main circuit board, then detachment detection accuracy is improved, but the device structure becomes more complex
Solution Approach 1:
The conductive path is divided into multiple segments: the light-transmitting conductive layer in the lens unit and separate conductive paths in the frame. These segmented conductive elements are electrically connected through the main circuit board, allowing independent detection of detachment at different locations while maintaining overall system integration.
Solution Approach 2:
The main circuit board serves as an intermediary that electrically connects the separated conductive paths. This intermediary component allows the conductive elements to be spatially separated for improved detection accuracy while maintaining electrical continuity through the circuit board's trace connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables detection of optical element detachment, preventing damage and improving system reliability by stopping operation when detachment is detected, thus ensuring the module's safety and efficiency.
Implementation Method 1
The lens unit is provided with at least one light-transmitting conductive layer electrically connected to the at least two second conductive paths
Data Source
AI summary
A flip-chip light-emitting module includes a main circuit board, a heat dissipation substrate, a package assembly, and a light-emitting chip. The package assembly includes a frame surrounding the heat dissipation substrate and a lens unit disposed in the frame. The frame includes a first conductive path and at least two second conductive paths separated from each other, and the first conductive path and the second conductive paths are electrically connected to the main circuit board. The light-emitting chip is disposed on a heat dissipation substrate including a top conductive contact and a light-emitting surface on the same side of the light-emitting chip. The top conductive contact is electrically connected to the first conductive path through a conductor. The lens unit is provided with at least one light-transmitting conductive layer electrically connected to the at least two second conductive paths.