Flip-Chip MEMS Package With Getter Film
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Solution Overview
Problem
Conventional microelectromechanical systems (MEMS) device packages are complex, expensive, and result in large overall sizes, failing to meet the demand for smaller components in miniaturized circuitries due to inefficiencies in sealing and contamination protection.
Innovation Solution
A MEMS device package using flip-chip technology with a non-evaporable getter material film deposited between the MEMS device and the substrate, sealed by a cover structure, maintains a high vacuum and reduces gas contaminants, allowing for miniaturization and improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging methods (wire-bonding, plasma cleaning, eutectic sealing) are used, then the MEMS device is protected and sealed, but the overall package size becomes large and the manufacturing process becomes complex and expensive
Solution Approach 1:
The patent extracts and eliminates unnecessary intermediate steps from conventional packaging processes. By using flip-chip mounting with direct contact pads and dispensing encapsulant material directly to seal the cavity, the method removes steps such as wire-bonding, plasma cleaning, and eutectic sealing, thereby simplifying the manufacturing process while maintaining sealing quality
Solution Approach 2:
The patent combines multiple functions into fewer steps. The flip-chip mounting simultaneously achieves electrical connection and mechanical positioning, while the encapsulant dispensing simultaneously fills the cavity and creates the hermetic seal, reducing the overall number of manufacturing steps required
2Reliability
If conventional packaging methods are used, then the MEMS device is protected, but the overall package size becomes large
Solution Approach 1:
The patent implements nesting by placing the MEMS device directly into a cavity formed within the substrate, then filling the same cavity with encapsulant material that serves both as structural support and hermetic seal. This nested arrangement eliminates the need for separate packaging components, minimizing the overall package volume while maintaining protection
Solution Approach 2:
The patent transitions from conventional planar packaging to a three-dimensional cavity-based structure. By forming a cavity within the substrate and using vertical encapsulant filling, the design utilizes the third dimension to achieve compact packaging that protects the MEMS device while minimizing footprint and overall volume
3Object-affected harmful factors
If the package is sealed under vacuum, then gas contaminants are reduced, but gas molecules can still be absorbed or desorbed from materials within the package
Solution Approach 1:
The patent applies preliminary action by forming the cavity structure and positioning the MEMS device before final encapsulation. The encapsulant is then dispensed to fill the cavity and create a hermetic seal that prevents future gas exchange, effectively locking in the vacuum environment before desorption or outgassing can occur
Solution Approach 2:
The encapsulant material creates an inert, hermetic environment that isolates the MEMS device from external atmospheric contaminants. This hermetic seal prevents gas molecules from entering or leaving the package cavity, maintaining the vacuum environment and preventing corrosion or degradation of the MEMS device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves higher accuracy and long-term performance of MEMS devices by reducing gas contamination and enabling smaller package sizes, thus supporting miniaturization and reduced production costs.
Implementation Method 1
a film of non-evaporable getter material is disposed on the first substrate plane at least partially in the interspace
Implementation Method 2
the non-evaporable getter material shall mean a reactive material having the ability to combine with gas molecules chemically or by absorption
Implementation Method 3
A cover structure encapsulates the MEMS device by sealing to the first substrate plane and enclosing the MEMS device between the first substrate plane and the cover structure
Implementation Method 4
An MEMS device with a first and a second contact pad arranged on a front side of the MEMS device is mounted in flip-chip technology on the first substrate plane
Data Source
AI summary
A microelectromechanical systems device package includes a MEMS device mounted in flip-chip technology on a substrate. A film of non-evaporable getter material is disposed between the substrate and the MEMS device. A cover structure encapsulates the MEMS device. This invention further provides a method for manufacturing the microelectromechanical systems device package.