Flip Chip Packaging Grooves for Resin Containment

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Solution Overview

Problem

Flip chip packaging systems face issues with resin bleeding, delamination, and moisture absorption due to low fillet strength and viscosity of capillary underfill materials, leading to defects in integrated circuit packaging.

Innovation Solution

The integration of a substrate with a material layer featuring parallel grooves in the fillet region, which act as trenches to contain the resin and enhance its adhesion, reducing bleeding and delamination, and providing a labyrinth-like seal to prevent moisture absorption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If capillary underfill material is used in flip chip packaging, then electrical connection speed is improved, but resin bleeding and delamination occur due to low viscosity and low fillet strength

Engineering Contradiction:

Improveelectrical connection speedVSAvoidfillet strength

Core Design Contradiction:

SpeedVSReliability

Solution Approach 1:

The patent divides the fillet region into multiple segments by creating grooves that partition the space between the integrated circuit and substrate. This segmentation contains the low-viscosity resin within defined regions, preventing it from spreading uncontrollably while maintaining the electrical connection benefits of capillary underfill material.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies different structural properties to different regions of the packaging system. The grooves create zones with enhanced resin containment properties in the fillet region, while the center region maintains open capillary channels for resin flow and electrical connection. This local differentiation allows the system to simultaneously achieve fast electrical connections and high fillet strength.

Inventive Principle:

Principle #3Local quality

2Ease of operation

If capillary underfill material with low viscosity is used, then resin flow and electrical connection are improved, but delamination and moisture absorption occur

Engineering Contradiction:

Improveresin flowVSAvoidmoisture absorption

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The grooves partition the fillet region into discrete segments that act as barriers to moisture migration. Each segmented region contains resin and prevents moisture from penetrating between the integrated circuit and substrate, thereby reducing delamination and moisture absorption while preserving resin flow characteristics.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent converts the harmful effect of low-viscosity resin (uncontrolled spreading and delamination) into a beneficial feature by using the grooves to guide and contain the resin flow. The same low-viscosity property that causes bleeding becomes advantageous for capillary action within the grooved channels, ensuring proper resin distribution while preventing delamination.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Strength

If fillet strength is increased to prevent delamination, then moisture resistance improves, but resin bleeding occurs due to constrained resin containment

Engineering Contradiction:

Improvefillet strengthVSAvoidresin bleeding

Core Design Contradiction:

StrengthVSObject-generated harmful factors

Solution Approach 1:

The grooves create segmented regions that simultaneously enhance fillet strength through increased surface area for adhesion and prevent resin bleeding by containing resin within defined boundaries. The segmentation provides both mechanical strength and containment functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces a vertical dimension to resin containment by creating grooves that extend into the fillet region. This dimensional change provides three-dimensional resin containment structures that increase fillet strength through enhanced adhesion surfaces while preventing lateral resin bleeding.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces resin bleeding, enhances mechanical strength, and improves moisture resistance, resulting in a more reliable and efficient integrated circuit packaging system without increasing the system's footprint.

Implementation Method 1

grooves in a material layer that are substantially parallel and adjacent an integrated circuit... forming a resin between the substrate and the integrated circuit

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Implementation Method 2

grooves in a material layer that are substantially parallel and adjacent an integrated circuit... forming a resin between the substrate and the integrated circuit that contacts a trench trace exposed by the grooves

Methodology Applied

Scientific EffectMechanical interlocking: Mechanical Fastener

Implementation Method 3

grooves in a material layer that are substantially parallel and adjacent an integrated circuit... providing a labyrinth-like seal to prevent moisture absorption

Methodology Applied

Scientific EffectDiffusion barrier: Diffusion Barrier

Data Source

PatentUS8536718B2Integrated circuit packaging system with trenches and method of manufacture thereof

Publication Date: 2013.09.17 STATS CHIPPAC MANAGEMENT PTE LTD

AI summary

A method of manufacture of an integrated circuit packaging system includes: providing a substrate with a material layer including grooves in a fillet region that are substantially parallel and adjacent an integrated circuit; and forming a resin between the substrate and the integrated circuit that contacts a trench trace exposed by the grooves.