Flip Chip IC Packaging with Segmented Isolation Zones

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional semiconductor package structures face challenges in miniaturization, reliability, and cost-effectiveness, particularly in portable devices, where they struggle to achieve high packaging density and performance while maintaining low profiles and reducing costs.

Innovation Solution

The integrated circuit packaging system involves a lead with an integrated circuit device and an external connector, both electrically isolated, mounted over a package encapsulation with the lead and connector exposed, allowing for independent operation and increased packaging density.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If conventional semiconductor package structures are used, then manufacturing simplicity is maintained, but packaging density and miniaturization are limited

Engineering Contradiction:

Improvepackaging densityVSAvoidpackage structure complexity

Core Design Contradiction:

Quantity of substanceVSDevice complexity

Solution Approach 1:

The package structure is segmented into distinct functional zones: a first region containing a first integrated circuit device, a second region containing a second integrated circuit device, and an intermediate region between them. This segmentation allows each region to be independently designed and optimized, enabling higher packaging density while maintaining manufacturing simplicity through modular assembly.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from conventional two-dimensional planar packaging to a three-dimensional stacked package structure where integrated circuit devices are arranged in multiple layers and regions vertically and horizontally. This dimensional expansion significantly increases packaging density without proportionally increasing manufacturing complexity, as each layer can be processed independently before final assembly.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If integrated circuits are closely packed to achieve miniaturization, then device size is reduced, but reliability and electrical isolation become challenging

Engineering Contradiction:

Improvepackage sizeVSAvoidelectrical isolation reliability

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

An intermediate region is introduced between the first and second integrated circuit devices, serving as an intermediary zone that provides electrical isolation and signal routing functionality. This intermediate region acts as a buffer that prevents electrical interference between closely packed devices while maintaining compact overall package dimensions, thus preserving reliability during miniaturization.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

Different regions of the package are assigned different functional qualities: the first and second regions contain active integrated circuit devices, while the intermediate region is specifically designed for electrical isolation and signal management. This local differentiation of functional qualities allows close packing of devices while maintaining reliable electrical isolation through specialized intermediate structures.

Inventive Principle:

Principle #3Local quality

3Quantity of substance

If multiple integrated circuit devices are packaged together, then packaging density increases, but manufacturing complexity and cost increase

Engineering Contradiction:

Improvepackaging densityVSAvoidmanufacturing simplicity

Core Design Contradiction:

Quantity of substanceVSEase of manufacture

Solution Approach 1:

The package is segmented into independently manufacturable regions that can be processed, tested, and assembled separately. Each region containing an integrated circuit device can be prepared independently using standard manufacturing processes, then combined in the final assembly stage. This segmentation maintains manufacturing simplicity by breaking down complex multi-device packaging into manageable modular units.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The package structure employs universal design elements and standardized interfaces that can accommodate multiple different integrated circuit devices across different regions. The intermediate region uses standardized signal routing and isolation structures that work with various device types, enabling high packaging density without requiring custom manufacturing processes for each device combination, thus maintaining ease of manufacture.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS9034692B2Integrated circuit packaging system with a flip chip and method of manufacture thereof

Publication Date: 2015.05.19 STATS CHIPPAC LTD

AI summary

A method of manufacture of an integrated circuit packaging system includes: providing a lead; placing an integrated circuit device, having an external connector, adjacent to and electrically isolated from the lead; mounting an integrated circuit over the lead and the integrated circuit device with the integrated circuit electrically isolated from the integrated circuit device; and forming a package encapsulation, having an encapsulation base, over the lead, the integrated circuit, and the integrated circuit device with the lead and the external connector exposed from the encapsulation base.