Flip Chip Package With Segmented Units And Ring Pads
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Solution Overview
Problem
Current flip-chip bonding technologies face limitations in increasing contact density and output pin count within a compact package volume due to manufacturing constraints and costs.
Innovation Solution
A flip chip package design featuring a substrate with input and output wires, a chip body comprising multiple package units connected by bumps and wires, allowing for higher contact density and output pin count without significantly enlarging the package volume, achieved through a single bonding process and efficient layout of pads and seal rings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the contact density of the IC chip is increased to achieve higher output pin count, then the output pin count is improved, but the manufacturing complexity and cost increase due to manufacturing limits
Solution Approach 1:
The chip body is divided into multiple separate package units (first package unit, second package unit, etc.), each containing its own pads and seal ring. These units are then bonded together to form a complete chip package, enabling higher output pin count while maintaining manageable manufacturing complexity for each individual unit.
Solution Approach 2:
Multiple package units are bonded together through bumps to form an integrated chip body with high contact density. The bonding process merges separate manageable units into a unified high-pin-count package, achieving both manufacturing feasibility and high output pin count.
2Volume of stationary object
If the contact density is increased to achieve compact package volume, then the volume is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
The chip body is segmented into multiple package units with pads arranged in ring paths. This segmentation allows for standardized unit design and assembly, reducing the overall package volume while maintaining achievable bonding precision through repeated modular assembly.
Solution Approach 2:
Pads are arranged in ring paths (circular/annular configuration) rather than linear or grid patterns, utilizing two-dimensional space more efficiently within each package unit. This dimensional arrangement increases contact density within the same footprint, reducing overall package volume while maintaining manufacturable precision levels.
Data Source
AI summary
A flip chip package includes a substrate, a chip body bonding on the substrate and bumps connected between the chip body and the substrate. The substrate includes input wires and output wires. The chip body includes a first package unit including a first seal ring and first pads and a second package unit including a second seal ring and second pads. The chip body extends continuously between the first seal ring and the second seal ring. Each of the input wires has one end overlapping the chip body and the other end positioned at a first bonding region of the substrate. Each of the output wires has one end overlapping the chip body and the other end positioned at a second bonding region of the substrate. The first bonding region and the second bonding region are located at opposite sides of the chip body.