Flip-Chip Semiconductor Heat Dissipation via Interlayer Sheet
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Solution Overview
Problem
Semiconductor devices with flip-chip bonded semiconductor elements face challenges in heat dissipation, as the memory controller generates significant heat, potentially leading to operational issues due to inadequate heat release.
Innovation Solution
Incorporating a heat-releasing sheet with high thermal conductivity, positioned between the memory controller and the wiring substrate, to facilitate effective heat dissipation through both bump electrodes and the heat-releasing sheet, enhancing the semiconductor memory device's heat-releasing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If flip-chip bonded semiconductor elements are used to increase operation speed, then productivity and performance are improved, but heat dissipation becomes inadequate and temperature rises
Solution Approach 1:
The patent divides the heat dissipation function into multiple independent paths: one through the bump electrodes to the wiring substrate, and another through the heat-releasing sheet to the molding resin and external environment. This segmentation allows heat to be dissipated through parallel channels, effectively reducing temperature without compromising the high-speed operation enabled by flip-chip bonding.
Solution Approach 2:
The heat-releasing sheet acts as an intermediary thermal conduction path between the memory controller and the external environment. It provides an additional heat transfer medium that complements the direct thermal path through bump electrodes, enabling more efficient heat removal from the high-speed semiconductor element.
2Temperature
If heat-releasing sheet is added to improve heat dissipation, then temperature control is improved, but device complexity increases
Solution Approach 1:
The heat-releasing sheet serves multiple functions simultaneously: it acts as a thermal conduction path for heat dissipation, provides mechanical support and stress distribution for the flip-chip bonded semiconductor element, and serves as an attachment surface for the molding resin. This multi-functionality allows effective heat management without proportionally increasing device complexity.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the interface between the memory controller and the external environment by introducing the heat-releasing sheet with high thermal conductivity. This parameter change enables effective heat dissipation while maintaining a relatively simple structural configuration through the integration of the sheet into the existing packaging architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of a heat-releasing sheet with thermal conductivity higher than the surrounding resins significantly improves heat dissipation, ensuring the semiconductor memory device operates efficiently by providing multiple heat-releasing paths and maintaining stability.
Implementation Method 1
a heat-releasing sheet with high thermal conductivity, positioned between the memory controller and the wiring substrate
Data Source
AI summary
A semiconductor device includes: a substrate on which wiring is formed; a first semiconductor element flip-chip bonded to the substrate; a second semiconductor element provided on the first semiconductor element; a first resin provided in at least part of a region between the first semiconductor element and the substrate; a second resin provided in at least part of a region between the second semiconductor element and the substrate; and a member having a thermal conductivity higher than a thermal conductivity of the first resin and a thermal conductivity of the second resin, provided between the first resin and the second resin, having a part overlapping with an upper surface of the first semiconductor element, and having another part overlapping with a first wiring part as part of the wiring in a top view.