Flip-Chip SSRT Assembly With Transmissive Support for Wire-Bond Limits
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Solution Overview
Problem
Conventional solid-state radiation transducer (SSRT) devices face issues with wire bonding, including space constraints in miniaturized applications, complex and time-consuming process formation, and reliability problems due to differential thermal expansion, leading to potential failure.
Innovation Solution
The implementation of flip-chip mounting with a transmissive support assembly that eliminates wire bonds and unnecessary packaging elements, using a transmissive support assembly that is electrically and mechanically coupled to the radiation transducer, allowing for improved heat dissipation and light modification while maintaining compatibility with external circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect SSRTs to other device components, then electrical connections can be established, but the device occupies significant physical space and the connections are unreliable due to differential thermal expansion
Solution Approach 1:
The patent removes wire bonds and wire bonding processes from the SSRT device structure, extracting the problematic connection method that caused reliability issues and space occupation. Instead, direct flip-chip mounting connects the SSRT die directly to the substrate without intermediate wire bonds, eliminating the source of thermal expansion problems and reducing device volume.
Solution Approach 2:
The patent merges the electrical connection function directly into the mounting structure by using flip-chip technology where solder bumps on the SSRT die directly contact substrate pads. This combines mechanical support, electrical connection, and thermal management into a single integrated structure, eliminating the need for separate wire bonds.
2Ease of manufacture
If wire bonding is used to connect SSRTs, then electrical connections are formed, but the process is intricate and time-consuming requiring expensive equipment
Solution Approach 1:
The patent extracts the wire bonding process entirely from the manufacturing sequence, eliminating the intricate and time-consuming steps of wire attachment, bonding, and formation. The flip-chip mounting process replaces this with a single-step direct connection approach that is faster and requires less expensive equipment.
Solution Approach 2:
The patent replaces the mechanical wire bonding system with a direct flip-chip mounting system. Instead of using wire bonding equipment to attach wires, the process uses automated pick-and-place or reflow soldering to directly mount the SSRT die to the substrate, substituting a simpler, faster manufacturing process.
3Reliability
If conventional packaging components are used with SSRTs, then the SSRT is supported and protected, but the packaging contains unnecessary redundancy and reduces device efficiency
Solution Approach 1:
The patent extracts unnecessary packaging components from the conventional SSRT structure, removing redundant elements such as separate mounting brackets, excessive protective enclosures, and non-essential support structures. Only the essential functions are retained in the simplified packaging design.
Solution Approach 2:
The patent makes the remaining packaging components multi-functional, where the substrate and mounting structure simultaneously provide mechanical support, electrical connection, thermal management, and physical protection. This eliminates the need for separate dedicated components for each function, reducing overall packaging complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability and functionality of SSRT devices by eliminating wire bonding failures and reducing packaging redundancy, ensuring stable connections and efficient heat management, even in high-temperature applications.
Implementation Method 1
a transmissive support assembly that is electrically and mechanically coupled to the radiation transducer, allowing for improved heat dissipation
Implementation Method 2
an optical component (e.g., a phosphor), and an encapsulant
Data Source
AI summary
Solid-state radiation transducer (SSRT) devices and methods of manufacturing and using SSRT devices are disclosed herein. One embodiment of the SSRT device includes a radiation transducer (e.g., a light-emitting diode) and a transmissive support assembly including a transmissive support member, such as a transmissive support member including a converter material. A lead can be positioned at a back side of the transmissive support member. The radiation transducer can be flip-chip mounted to the transmissive support assembly. For example, a solder connection can be present between a contact of the radiation transducer and the lead of the transmissive support assembly.