Flip-Chip Package Tape Resin Void Prevention
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Solution Overview
Problem
Conventional flip-chip mounting technologies experience void formation in under fill resin at high temperatures, leading to reduced adhesiveness, thermal conductivity, and humidity resistance.
Innovation Solution
A semiconductor device and manufacturing method involving a melted resin subjected to fluid pressure to prevent void formation, with a resin sheet covering the chip and substrate to ensure even resin distribution and absorption, using a press portion to apply fluid pressure and harden the resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If flip-chip mounting is performed at high temperature, then mounting efficiency is improved, but void formation in under fill resin occurs
Solution Approach 1:
The under fill resin is applied to the substrate before the flip-chip mounting process. This preliminary action ensures that the resin is in position to fill voids as they form during high-temperature mounting, preventing void formation while maintaining mounting efficiency
Solution Approach 2:
The viscosity of the under fill resin is changed by controlling its temperature and chemical composition. By adjusting these parameters, the resin becomes sufficiently fluid to fill voids during high-temperature mounting but maintains proper adhesion properties after curing
2Object-affected harmful factors
If under fill resin is provided between substrate and semiconductor chip, then foreign substance intrusion is restrained, but void formation occurs reducing adhesiveness and thermal conductivity
Solution Approach 1:
The under fill resin continuously fills and seals voids that form during the flip-chip mounting process. This continuous action ensures that foreign substance intrusion is prevented while maintaining the adhesiveness and thermal conductivity of the resin by eliminating voids
Solution Approach 2:
The under fill resin is formulated as a composite material with specific viscosity and adhesion properties. This composite formulation allows the resin to effectively fill voids, restrain foreign substance intrusion, and maintain high adhesiveness and thermal conductivity simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents void formation in the under fill resin, maintaining adhesiveness, thermal conductivity, and humidity resistance, and ensures uniform resin shape and chip absorption.
Implementation Method 1
arranging a semiconductor chip on the melted resin, pressing the semiconductor chip and flip-chip mounting the semiconductor chip on the substrate, and hardening the melted resin with the melted resin being subjected to a fluid pressure
Implementation Method 2
hardening the melted resin with the melted resin being subjected to a fluid pressure and forming a resin portion
Data Source
AI summary
A manufacturing method of a semiconductor device includes arranging a melted resin on a substrate, arranging a semiconductor chip on the melted resin, pressing the semiconductor chip and flip-chip mounting the semiconductor chip on the substrate, and hardening the melted resin with the melted resin being subjected to a fluid pressure and forming a resin portion.