Flip-Chip Microdevice Structure With Common Electrode VIA Access
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Solution Overview
Problem
Existing optoelectronic systems face challenges in integrating microdevices into substrates efficiently, particularly in providing access to microdevices and forming effective connections between microdevices and common electrodes, which hinders the formation of efficient optoelectronic devices and systems.
Innovation Solution
The method involves forming a release layer on a substrate, transferring microdevices using a bonding pad, creating planarization layers and VIA openings for access, and forming a common electrode to couple with microdevices through these openings, allowing for bonding to another substrate and forming pads for connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If microdevices are transferred onto a substrate using conventional methods, then integration is achieved, but access to the top of microdevices and formation of effective connections to common electrodes becomes difficult
Solution Approach 1:
The patent inverts the conventional transfer approach by first forming the common electrode on the substrate, then transferring microdevices onto it. This reversal enables direct connection between microdevice pads and the common electrode through VIA openings, solving the access and connection problem while maintaining integration efficiency
Solution Approach 2:
The common electrode is formed in advance on the substrate before microdevice transfer. This preliminary action allows VIA openings to be formed directly through the electrode and planarization layer, establishing connection paths before the microdevices are positioned, thereby facilitating easier access and connection formation
2Reliability
If multiple microdevices are integrated with individual connections, then device functionality is achieved, but system complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges multiple individual connection paths into a single common electrode structure. Instead of creating separate connection structures for each microdevice, all microdevices connect to the same continuous electrode through VIA openings, significantly reducing structural complexity while maintaining individual device functionality
Solution Approach 2:
The common electrode serves multiple functions simultaneously: it acts as an electrical connection for all microdevices, provides a mechanical support structure, and enables light extraction. This multi-functionality reduces the number of separate components needed, simplifying the overall device structure
3Ease of operation
If VIA openings are formed to access microdevices, then connection access is improved, but manufacturing precision requirements increase
Solution Approach 1:
The common electrode and planarization layer are formed with predetermined patterns before microdevice transfer. VIA openings are then formed through these pre-formed layers at specific locations, allowing precise alignment with microdevice pads without requiring high-precision operations during the transfer process itself
Solution Approach 2:
The planarization layer acts as an intermediary between the VIA openings and the microdevice pads. It provides a flat, uniform surface that facilitates precise VIA formation and alignment, while also compensating for any height variations in the underlying electrode structure, thereby reducing precision requirements
Data Source
AI summary
What is disclosed is structures and methods of integrating microdevices into a system substrate. In particular the structure comprises various components of buffer layer, release layer, pads, electrodes, VIA openings and various planarization layers and passivation layers. These components are configured to form an optoelectronic device or a system. Also described are methods to form an optoelectronic device.